Microlink Devices, Inc.

Vega Wave Systems, Inc.

Emcore Corporation

David McCallum

Noren Pan

Christopher Youtsey

Raymond Chan

Andree Wibowo

Alan Sugg

Haruki Miyamoto

Genevieve Martin

Glen Hillier

Duy Phach Vu

Mark Osowski

Rao Tatavarti

John M Dallesasse

Paul W Wachtel

Brett Lane

Dean A Richardson

Joseph Scheibenreif

Bryan Noble

Bogdan Andrei

Thomas Whitehead

Anthony Moretti

Victor C Elarde

Duy Pach Vu

The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.

Methods for fabricating thin film III-V compound solar cell

Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

High-efficiency, lightweight solar sheets

Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.

Integration of high-efficiency, lightweight solar sheets onto unmanned aerial vehicle for increased endurance

The present application utilizes an oxidation process to fabricating a Group III-V compound semiconductor solar cell device. By the oxidation process, a window layer disposed on a cell unit is oxidized to enhance the efficiency of the solar cell device. The oxidized window has an increased band gap to minimize the surface recombination of electrons and holes. The oxidized window also improves transparency at the wavelengths that were absorbed in the conventional window layer.

High efficiency group III-V compound semiconductor solar cell with oxidized window layer

Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

An array of optically coupled cavities (called micro-cavities) of a semiconductor laser are defined by either an etch and/or by a native oxide of an aluminum-bearing III-V semiconductor material and are arranged serially end-to-end along the longitudinal direction. An etch and/or native oxide defines a refractive index change for the longitudinal optical mode and confines the optical field within the micro-cavities, resulting in reflection and optical feedback distributed periodically along the laser stripe in the form of an optically coupled micro-cavity. The wavelength of emission of the laser is controlled by a combination of the length of the optical micro-cavities and the spacing between adjacent optical micro-cavities. Single-longitudinal-mode operation is exhibited over an extended drive current range. In one embodiment, two or more linear arrays of end-coupled micro-cavities are arranged in the longitudinal axis of the laser cavity to obtain a tunable laser. The device, with multiple reflectors constructed out of optical micro-cavities, is tuned either thermally or by current injection partitioned among the elements. The tunable laser exhibits a vernier tuning amongst resonances of the two or more optically-coupled micro-cavities.

Method of tuning a semiconductor laser device having coupled cavities

Wavelength tunable semiconductor laser having multiple sets of intercavity spacings

Wavelength selective and tunable semiconductor laser device with coupled cavities

An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK&#x2122; form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.3ae 10 Gigabit BASE LX4 physical layer.

Modular optical transceiver

Growing community of inventors

West Chicago, IL, United States of America

David McCallum