Rosemount Inc.

David Matthew Strei

David Alexander Andrew

David Andrew Broden

Nicholas Edward Meyer

Charles Ray Willcox

Kelly Michael Orth

Mark George Romo

Eric Petersen

Christopher Lee Eriksen

William Thomas Anderson

James L Gravel

Nicholas John Haywood

Joel David Vanderaa

Ivar Breen

Randall C Olson

Andrew John Wagener

Paul R Bedney, Jr

Jack M Cavanaugh

James Walters, Iii

Kenneth Guttsen

David Cutter

Charles R Weber

Blake T Petersen

David Pierce

Brian J Vogt

Troy L Blazek

A process fluid multivariable measurement system is provided. The multivariable measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. The multivariable measurement system also includes a temperature sensor assembly disposed within the thermowell, the temperature sensor assembly having at least one temperature sensitive element disposed therein. The multivariable measurement system also includes a pressure sensor assembly coupled to the thermowell, the pressure sensor assembly having at least one pressure sensitive element disposed therein. The multivariable measurement system further includes transmitter circuitry, communicatively coupled to the temperature sensor assembly and the pressure sensor assembly, configured to receive a temperature sensor signal from the at least one temperature sensitive element and responsively generate a temperature measurement output based on the temperature sensor signal. The transmitter circuitry is further configured to receive a pressure sensor signal from the at least one pressure sensitive element and responsively generate a pressure measurement output based on the pressure sensor signal.

Thermowell with pressure sensing capabilities

A pressure capsule/header assembly for a process fluid pressure transmitter is provided. An isolator plug has an isolation diaphragm at a first end thereof and a second end spaced from the first end. The isolator plug has a fill fluid passageway fluidically coupling the first end to the second end. A header has a first end configured to carry a pressure sensor and a second end spaced from the first end. The header has at least one electrical interconnect extending from the first end to the second end. A biaxial support ring is disposed about an outer surface of the header. The biaxial support ring and the header define a tapered interference interface therebetween. The header is welded to the isolator plug at a first weld and the biaxial support ring is welded to the isolator plug at a location that is spaced from the second end of the header.

High pressure capsule and header for process fluid pressure transmitter

An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board.

Modular hybrid circuit packaging

A differential pressure sensor module includes a base having a pair of process fluid pressure inlets and defining a sensor chamber having a sensor chamber inlet. A differential pressure sensor is disposed within the sensor chamber and has an inlet configured to receive a first pressure and provide a signal indicative of a difference between the first pressure and a sensor chamber pressure external to the differential pressure sensor within the sensor chamber. A pair of isolation diaphragms are provided in substantially the same plane, with each isolation diaphragm sealing a respective process fluid pressure inlet. A first fluid passageway is operably coupled to one of the isolation diaphragms and the inlet of the differential pressure sensor. A second fluid passageway is operably coupled to the other of the isolation diaphragms and to the sensor chamber inlet. An overpressure protection feature is operably coupled to the sensor chamber, the first fluid passageway and the second fluid passageway.

Pressure sensor module for high working pressure applications

A pressure sensor capsule includes a capsule body, an isolator, a pressure sensor, and a fluid fill pathway. The capsule body defines a process chamber. The isolator is supported by the capsule body and is exposed to the process chamber. The pressure sensor produces a sensor output that is indicative of a pressure within an interior chamber, which is isolated from the process chamber by the isolator. The fluid fill pathway extends from the process chamber to the interior chamber.

Pressure sensor capsule

A pressure sensor assembly for use in sensing a pressure of a process fluid in a high temperature environment includes an elongate sensor housing configured to be exposed to the process fluid and having a cavity formed therein. A pressure sensor is positioned in the cavity of the elongate sensor housing. The pressure sensor has at least one diaphragm that deflects in response to applied pressure and includes an electrical component having an electrical property which changes as a function of deflection of the at least one diaphragm which is indicative of applied pressure. A flexible membrane in contact with the at least one diaphragm is disposed to seal at least a portion of the cavity of the sensor housing from the process fluid and flexes in response to pressure applied by the process fluid to thereby cause deflection of the at least one diaphragm.

Pressure sensor assembly

An in-line process fluid pressure transmitter is provided. The transmitter includes a process fluid connector configured to couple to a source of process fluid. A plug is coupled to the process fluid connector and has a passageway configured to convey fluid to a distal end of the plug. A pressure sensor subassembly is coupled to the plug at a weld. The pressure sensor subassembly has a pressure sensor operably coupled to the distal end of the passageway such that the pressure sensor reacts to process fluid pressure. The plug includes a sidewall encircling the weld. Transmitter electronics are coupled to the pressure sensor and configured to measure an electrical characteristic of the pressure sensor and provide a process fluid pressure value based on the measured electrical characteristic.

In-line process fluid pressure transmitter for high pressure applications

Electrical power is produced by a first process component, a first heat pipe formed in part by a first cavity within the first process component, and a thermoelectric generator assembly. The thermoelectric generator assembly is thermally coupled on one side to a heat sink and on the other side to the first heat pipe. The first process component is in direct contact with a first process fluid and the first cavity is proximate the first process fluid. The thermoelectric generator assembly produces electrical power.

Integral thermoelectric generator for wireless devices

A wireless process communication adapter for field devices is provided. The adapter includes a metal housing having a first end and a second end. A chamber is defined between the first and second ends. A radio-frequency transparent radome is coupled to the first end. The second end has a field device coupling configured to attach to a field device. At least one circuit board is disposed within the chamber. The circuit board supports at least wireless process communication circuitry. A plurality of wires is coupled to the at least one circuit board and extends through the field device coupling. A silicone potting fills substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry.

Wireless process communication adapter with improved encapsulation

A multivariable process fluid transmitter module includes a base having a pair of recesses. A pair of pedestals is provided with each pedestal being disposed in a respective recess and being coupled to a respective isolation diaphragm. At least one line pressure assembly is mounted proximate one of the pedestals. The at least one line pressure assembly couples a respective isolation diaphragm to a line pressure sensor. A differential pressure sensor has a sensing diaphragm fluidically coupled to the isolation diaphragms by a fill fluid. At least one additional sensor is disposed to sense a temperature of a process fluid. Circuitry is coupled to the line pressure sensor, the differential pressure sensor, and the at least one additional sensor to measure an electrical characteristic of each of the line pressure sensor, the differential pressure sensor, and the at least one additional sensor. The circuitry is configured to provide an indication of fluid flow based on the measured electrical characteristic of each of the line pressure sensor, the differential pressure sensor and the at least one additional sensor.

Multivariable process fluid transmitter for high pressure applications

A process fluid pressure sensing system includes a process fluid pressure transmitter and a process manifold. The process fluid pressure transmitter has first and second pressure inlets and is configured to obtain a measurement relative to pressures applied at the first and second pressure inlets and provide a process variable output based on the measurement. The process manifold is operably coupled to a process fluid and has first and second pressure outlets. A first high-pressure coupling joins the first pressure outlet of the process manifold to the first pressure inlet of the process fluid pressure transmitter. A second high-pressure coupling joins the second pressure outlet of the process manifold to the second pressure inlet of the process fluid pressure transmitter. The first and second high-pressure fluid couplings are configured to accommodate misalignment between the respective pressure outlets and inlets.

High pressure fluid coupling

A pressure transmitter has a pressure sensor, an isolator diaphragm, and a fill tube. Interior passages in the pressure sensor module body are filled with isolator fluid and provide fluid connections. The isolator fluid couples pressure from the first isolator diaphragm assembly to the pressure sensor. A first crimp portion of the fill tube radially narrows into a substantially solid circular cylindrical cross section to form a first primary seal that is resistant to high pressure cycling.

Pressure transmitter with fill tube

A co-planar differential pressure sensor module is provided. The module includes a base having a pair of recesses. A pair of pedestals is also provided where each pedestal is disposed in a respective recess and is coupled to a respective isolation diaphragm. A differential pressure sensor has a sensing diaphragm and a pair of pressure sensing ports. Each port of the differential pressure sensor is fluidically coupled to a respective isolation diaphragm by a fill fluid. The module also includes circuitry coupled to the differential pressure sensor to measure an electrical characteristic of the sensor that varies with differential pressure. The base is constructed from a material that is suitable for submersion in seawater. A method of constructing a co-planar differential pressure sensor module is also provided. In another embodiment, a pressure sensor module is provided. The pressure sensor module includes a base having a recess. A pedestal is disposed in the recess and is coupled to an isolation diaphragm. A pressure sensor having a sensing diaphragm and a pressure sensing port is fluidically coupled to the isolation diaphragm by a fill fluid. Circuitry is coupled to the pressure sensor to measure an electrical characteristic of the sensor that varies with pressure. The base is constructed from a material that is suitable for submersion in seawater.

Pressure sensor module for sub-sea applications

A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.

MEMS packaging with improved reaction to temperature changes

An electrical connector protects a pressure sensor stem that protrudes from a pressure sensor capsule. The electrical connector includes a baseplate with a central hole and a peripheral wall joined to the baseplate and protruding below the baseplate. The peripheral wall slidingly engages the pressure sensor capsule as the pressure sensor stem passes through the central hole to protrude above the baseplate. A protective wall joined to the baseplate protrudes above the pressure sensor stem and protects the pressure sensor stem. A lead frame in the protective wall provides electrical connections to sensor contact pads on the pressure sensor stem.

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Waconia, MN, United States of America

David Matthew Strei