Asm IP Holding B.v.

Applied Materials, Inc.

David Marquardt

Carl Louis White

Mohith E Verghese

Eric James Shero

Petri Raisanen

Jereld Lee Winkler

John Kevin Shugrue

Jose Alexandro Romero

Thomas Aswad

Herbert Terhorst

Kyle Fondurulia

Andrew M Yednak, Iii

Showerhead assemblies, gas distribution plates, and systems including the same are disclosed. Exemplary showerhead assemblies include a gas distribution plate. Exemplary gas distribution plates include apertures designed to direct a flow of gas and to reduce stagnation of gas on surfaces of the plates.

Showerhead assembly and components thereof

A semiconductor device comprising a manifold for uniform vapor deposition is disclosed. The semiconductor device can include a manifold comprising a bore and having an inner wall. The inner wall can at least partially define the bore. A first axial portion of the bore can extend along a longitudinal axis of the manifold. A supply channel can provide fluid communication between a gas source and the bore. The supply channel can comprise a slit defining an at least partially annular gap through the inner wall of the manifold to deliver a gas from the gas source to the bore. The at least partially annular gap can be revolved about the longitudinal axis.

Manifolds for uniform vapor deposition

Embodiments of a solid chemical delivery system having a refillable sublimation vessel are provided herein. In some embodiments, a solid chemical delivery system includes: a refillable sublimation vessel including: a vessel body coupled to a vessel lid to define an interior volume of the refillable sublimation vessel, wherein the vessel lid includes a central refill port, a gas inlet port, and a gas outlet port; a flow restricting structure disposed in an upper portion of the interior volume; and a vertical appendage disposed in the interior volume and extending from a bottom plate of the vessel body; a refill cartridge removably coupled to the central refill port of the refillable sublimation vessel and having an internal volume therein; and a first valve disposed between the refillable sublimation vessel and the refill cartridge.

Refillable large volume solid precursor sublimation vessel

Ampoules including a housing, a lid and a floating structure are described. The floating structure includes a float with a volume determined to displace a predetermined volume of liquid within the ampoule. An outlet channel extends from the top surface of the float. A baffle is positioned along the length of the outlet channel and creates a saturation zone between the baffle and the float.

Constant headspace ampoule

Ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules include a container with an inlet port an outlet port, a manifold having a serpentine base creating a tortuous flow path and a filter media assembly in a bottom-fed configuration. The torturous flow path is defined by a plurality of elongate walls and a plurality of openings of the serpentine base ampoule, through which a carrier gas flows in contact with the precursor.

Bottom fed sublimation bed for high saturation efficiency in semiconductor applications

A semiconductor processing apparatus is disclosed. The apparatus may include, a reaction chamber and a susceptor dispose in the reaction chamber configured for supporting a substrate thereon, the susceptor comprising a plurality of through-holes in an axial direction of the susceptor. The apparatus may also include, a plurality of lift pins, each of the lift pins being disposed within a respective through-hole, and at least one gas transmitting channel comprising one or more gas channel outlets, the one or more gas channel outlets being disposed proximate to the through-holes. Methods for processing a substrate within a reaction chamber are also disclosed.

Semiconductor processing apparatus and a method for processing a substrate

Ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules include a container with an inlet port and an outlet port. The ampoules comprise an inlet plenum located between the inlet port and the cavity and an outlet plenum located between the outlet port and the cavity. A flow path is defined by a plurality of tubular walls and an ingress openings of the ampoule, through which a carrier gas flows in contact with the precursor.

Ampoule for a semiconductor manufacturing precursor

Embodiments described herein generally relate to apparatus having a canister with a sidewall, a top, and a bottom forming a canister volume. An inlet line and an outlet line is coupled to the top and is in fluid communication with the canister volume. A plate disposed within the canister volume forms a headspace volume below the plate. Each of the inlet line and the outlet line is in fluid communication with the headspace volume. The apparatus includes standoffs extending from a lower surface of the plate. The standoffs include a lower surface area substantially parallel with the plate.

Apparatus, system, and method for generating gas for use in a process chamber

Bottom-fed ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules comprise an outer cylindrical wall and an inner cylindrical wall defining a flow channel in between and a bottom wall having a top surface with a plurality of concentric elongate walls, each wall comprising an opening offset from the opening in adjacent walls defining a gas exchange zone through which a carrier gas flows in contact with the precursor.

The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element. Some embodiments include two or more stacked sealing elements.

Growing community of inventors

Scottsdale, AZ, United States of America

David Marquardt