Harris Corporation

Avx Corporation

Kyocera Avx Components Corporation

L-3 Communications Titan Corporation

David M Smith

Louis Joseph Rendek, Jr

Lawrence Wayne Shacklette

Michael Raymond Weatherspoon

Robert Patrick Maloney

Jeffrey A Schlang

Clifford Hessel

James Covosso Francis

Howard Glen Ebersman

John Gorton

Christopher Robert Brown

James Robert Tiffany

A self-aligning capacitor electrode assembly having an improved breakdown voltage is disclosed. The electrode assembly comprises a first electrode having a generally planar shape and a length in a first direction. The electrode assembly also comprises a second electrode having a generally planar shape and a length in a second direction. The second electrode overlaps the first electrode such that an overlapping region is formed. The overlapping region has an area that is insensitive to a relative misalignment in the first direction between the first electrode and the second electrode that is less than a first offset distance. A ratio of the length of the first electrode to the first offset distance is less than about 45.

Self-aligning capacitor electrode assembly having improved breakdown voltage

A phased array antenna is provided. The phased array antenna includes a dome shaped substrate. The phased array antenna further includes a plurality of antenna elements disposed on the substrate.

AESA compound curred dome phased array antenna

A phased array antenna is provided. The phased array antenna includes a tube shaped substrate. The phased array antenna further includes a plurality of antenna elements disposed on the substrate.

AESA radial geometry phased array antenna

Disclosed is a filter device comprising at least a shell, a first discoidal capacitor, a second discoidal capacitor, and an inductor. The shell is elongated in a stack direction. The first discoidal capacitor and the second discoidal capacitor are disposed within the shell, where the first discoidal capacitor is stacked above the second discoidal capacitor along the stack direction. The inductor comprises a first patterned conductive line disposed within the shell. The first patterned conductive line is coupled between the first discoidal capacitor and the second discoidal capacitor. The first patterned conductive line is wound in a winding direction traversing the stack direction.

Coaxial RF filter with discoidal capacitor

A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

Method for making electrical structure with air dielectric and related electrical structures

A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

Method for making an electrical inductor and related inductor devices

An IC device () includes an IC body () having a base layer () and first and second upper layers () on the base layer. The IC body includes a cavity region () extending through said base and first upper layers and at least a portion of said second upper layer. In the IC device, a portion of said second upper layer in the cavity region comprises a planar inductive element () having first and second contacting ends (). In the IC device, at least one support member () extends at least partially into said cavity region from said IC body in at least a first direction parallel to said base layer and intersects at least a portion of said planar inductive element.

Inductor structures for integrated circuit devices

An spiral inductor () formed on a semiconductor substrate (). One or more insulating layers () is disposed on a first surface of the semiconductor substrate. A spiral structure () is formed of a first conductive material layer disposed on the insulating layer. The spiral structure has a terminal end () at a location enclosed by one or more coils of the spiral. A ground plane () is formed of a second conductive material and disposed on a second surface located on a side of the substrate opposed from the first surface. The ground plane is defected so as to define a signal trace () formed from a portion of the ground plane. A conductive via () extends through the one or more insulating layers, and through the semiconductor substrate, to form an electrical connection between the ground plane and the terminal end.

Defected ground plane inductor

A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer.

Battery cell for MEMS device and related methods

Semiconductor devices () and methods of making the same. Each of the semiconductor devices includes a substrate () having a first surface () and an opposing second surface. A vertical capacitive element () is disposed on the first surface of the substrate. The vertical capacitive element comprises a plurality of parallel conductive plates () extending transverse to the first surface of the substrate. Adjacent conductive plates are spaced a distance D from each other. A dielectric material () can be disposed in a space separating the adjacent conductive plates. Each of the conductive plates has a height-to-width (h/w) ratio greater than or equal to one.

Vertical capacitors formed on semiconducting substrates

A method of making a semiconductor device and devices thereof are provided. The semiconductor device () includes a semiconductor substrate () having opposing first and second surfaces (). The device further includes a planar inductor element () disposed on said first surface. The planar inductive element () comprises a freestanding electrical conductor extending along a meandering path and defining a plurality of windings (), where the electrical conductor has a width and a height, and where a height-to-width (HW) ratio is substantially greater than 1.

High Q vertical ribbon inductor on semiconducting substrate

In a radio network that includes at least one base station and at least one remote station, signals are modulated for transmission from the remote stations by embedding known information throughout the signal in a predetermined pattern and a group of sample vectors of a signal received by at least one base station of the network are collected and processed to detect a said received signal that resulted from propagation of a signal from a remote station of the network. The group of sample vectors is collected from (a) signals that are received by more than one base station of the network; and/or (b) signals that are received simultaneously at different frequencies by at least one base station of the network.

Growing community of inventors

Sebastian, FL, United States of America

David M Smith