Bridge Semiconductor Corporation

Maxtor Corporation

David M Sigmond

Charles W C Lin

Chia-Chung Wang

Cheng-Lien Chiang

Yu Sun

Bernhard Hiller

Matthew A O'Hara

Don Brunnet

A disk drive includes a drive housing, a storage disk, a head suspension assembly, an actuator assembly and a controller. The storage disk has a disk surface including a data region that stores data. In one embodiment, the head suspension assembly includes a slider and an attitude adjuster. The slider has an inner side edge, an outer side edge and a data transducer. The attitude adjuster can adjust a roll attitude and/or a pitch attitude of the slider relative to the disk surface. The slider moves between a first position wherein the data transducer is not positioned directly over the data region and a second position wherein the data transducer is positioned directly over the data region during one of a load operation and an unload operation. The controller controls an electrical signal to the attitude adjuster during one of the load operation and the unload operation to dynamically adjust the attitude of the slider. The attitude adjuster can include one or more piezoelectric elements that expand and/or contract to adjust the orientation of the slider relative to the storage disk.

Slider of a disk drive having data favorable load/unload attitude

A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Method of making a semiconductor chip assembly with a post/base/cap heat spreader

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base.

Semiconductor chip assembly with post/base/cap heat spreader

A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.

Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment

A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies and a conductive bond. The first semiconductor chip assembly includes a first semiconductor chip and a first conductive trace with a first routing line and a first pillar. The second semiconductor chip assembly includes a second semiconductor chip and a second conductive trace with a second routing line and a second pillar. The chips are aligned with one another, the pillars are disposed outside the peripheries of the chips and aligned with one another, and the first pillar extends into a cavity in the second pillar. The conductive bond is within the cavity and contacts and electrically connects the pillars.

Three-dimensional stacked semiconductor package with pillars in pillar cavities

A disk drive uses seek profile manipulation to provide enhanced transducer fly height control. The maximum seek velocity that is used during a seek operation is made dependent upon, among other things, the direction associated with the seek operation (i.e., either radially inward or radially outward with respect to the disk). In a preferred embodiment, the maximum seek velocity in a direction that normally results in a fly height loss is made less than the maximum seek velocity in the opposite direction. Thus, a minimum transducer fly height can be maintained with minimal effect on average seek time in the disk drive. In one approach, the maximum seek velocity values are stored within a lookup table within the disk drive.

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Superior, CO, United States of America

David M Sigmond