Cray Research, Inc.

David M Morton

Steven J Dean

Eugene N Reshanov

Eric J Mueller

Stephen A Bowen

The present invention discloses a method and apparatus for conductively transferring heat away from electrical devices located on daughter boards attached to mother boards. The preferred method involves the steps of conductively transferring heat from each electrical device to a conductive layer located within the daughter board, transferring heat from the conductive layer within the daughter board to a conductive structure located on the surface of the daughter board, and transferring heat from the conductive structure to a cooling surface located on the cold plate. The preferred apparatus includes a mother board, a cold plate adjacent the mother board and attached to the mother board, a daughter board with an electrical device attached thereto, the daughter board attached to the mother board opposite the cold plate. The daughter board lies in a plane which is adjacent and substantially parallel to the plane of the mother board. Also included is conductive heat transfer means for conductively transferring heat energy from the electrical device on the daughter board to the cold plate.

Apparatus for cooling daughter boards

Computer cabinet

The present invention discloses an improved method and apparatus for dissipating heat from printed circuit boards and electronic devices mounted thereon. Printed circuit boards are provided with apertures therethrough for receiving thermal conductor pads. The thermal conductor pads may be secured in the apertures through the use of glue or by means of an interference fit. Glue may also be deposited on top of the thermal conductor pad to secure an electronic device thereto. The glue is cured in a manner that limits its thickness to a minimum value. The electronic device may be further secured to the printed circuit board by wave soldering. The opposite end of the thermal conductor pad contacts the cold plate.

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Eau Claire, WI, United States of America

David M Morton