Coherent, Inc.

Raydiance, Inc.

University of Colorado

Colorado State University Research Foundation

Radiance, Inc.

David M Gaudiosi

Michael R Greenberg

Michael Mielke

Ramanujapuram A Srinivas

Tim Booth

Jochen Deile

Mehmetcan Akbulut

Henry C Kapteyn

Laurent Vaissié

Jorge J Rocca

Timothy J Booth

Tenio V Popmintchev

Michael Shirk

Brendan A Reagan

Gordon Masor

Margaret M Mumane

Michael E Grisham

Eric Juban

An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.

Laser apparatus for cutting brittle material

Methods of and devices for forming edge chamfers and through holes and slots on a material that is machined using a laser, such as an ultrafast laser. The shaped material has predetermined and highly controllable geometric shape and/or surface morphology. Further, a method of and a device for preventing re-deposition of the particles on a material that is machined using a laser, such as an ultrafast laser. A fluid is used to wash off the particles generated during the laser machining process. The fluid can be in a non-neutral condition, with one or more chemical salts added, or a condition allowing the coagulation of the particles in the fluid, such that the particles can be precipitated to avoid the reattachment to the machined substrate.

Shaping of brittle materials with controlled surface and bulk properties

Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.

Singulation of layered materials using selectively variable laser output

Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.

Laser based processing of layered materials

Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Methods and systems for trimming circuits

An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

Polymer tubing laser micromachining

A chirped pulse amplification (CPA) system comprises an optical pulse stretcher and an optical pulse compressor that are mismatched in that the optical pulse compressor includes a bulk optical grating while the optical pulse stretcher does not. High order dispersion compensation is provided by an optical phase mask disposed within the optical pulse compressor.

Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system

A pre-ionized medium created by a capillary discharge results in more efficient use of laser energy in high-order harmonic generation (HHG) from ions. It extends the cutoff photon energy, and reduces the distortion of the laser pulse as it propagates down the waveguide. The observed enhancements result from a combination of reduced ionization energy loss and reduced ionization-induced defocusing of the driving laser as well as waveguiding of the driving laser pulse. The discharge plasma also provides a means to spectrally tune the harmonics by tailoring the initial level of ionization of the medium.

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Rohnert Park, CA, United States of America

David M Gaudiosi