Texas Instruments Corporation

David M Drew

Paul R Moehle

Eiman A Hegazi

Stephen J Smith

An enhanced gradient dragout system conserves plating chemicals, including precious metals by providing a series of tanks with cascading rinse solutions having a flow rate controlled by heating the first tank to increase the evaporation rate. A portion of the concentrated solution in the heated tank is returned to the process tank. The system minimizes the requirements for clean rinse water, and the need for emptying contaminated rinse tanks with associated recovery and disposal environmental and cost issues. The low cost system is flexible and the process is adapted to the material and process requirements of the plating line.

Gradient dragout system in a continuous plating line

A method and circuit (,) for monitoring an electroplating operation of an electroplating machine (,) of the type having a first electroplating cell (,) for depositing nickel onto an integrated circuit leadframe (,) and a second electroplating cell (,) for subsequently depositing palladium onto the leadframe (,). A first current (,) is applied in the first electroplating cell (,) to form a nickel deposit on the leadframe (,) and a second current (,) is applied in the second electroplating cell (,) to from a palladium deposit on the nickel deposit. The second current (,) is greater than the first current (,) if the electroplating machine (,) is operating normally. The first current (,) and second current (,) are compared in a comparator (,) during the electroplating operation, and if the second current (,) is less than the first current (,), an error signal is generated on an output line (,). If desired, the electroplating machine (,) may be stopped in response to the error signal.

Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process

A method and system for electroplating a metal coating onto a continuous part, such as the leadframe stock used in packaging integrated circuits, whereby the method comprises plating metal from a series of plating baths having the same or compatible chemical composition, supplying a continuous electrical connection between the D.C. power supply via a rotating contact held in intimate contact with the cathode, and cooling the contact by using the plating solution itself.

Integrated solution electroplating system and process

A method and circuit (14) for monitoring an electroplating operation of an electroplating machine (10) of the type having a first electroplating cell (18) for depositing nickel onto an integrated circuit leadframe (12) and a second electroplating cell (19) for subsequently depositing palladium onto the leadframe (12). A first current (30) is applied in the first electroplating cell (18) to form a nickel deposit on the leadframe (12) and a second current (31) is applied in the second electroplating cell (19) to from a palladium deposit on the nickel deposit. The second current (31) is greater than the first current (30) if the electroplating machine (10) is operating normally. The first current (30) and second current (31) are compared in a comparator (44) during the electroplating operation, and if the second current (31) is less than the first current (30), an error signal is generated on an output line (50). If desired, the electroplating machine (10) may be stopped in response to the error signal.

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Attleboro, MA, United States of America

David M Drew