Hewlett-packard Development Company, L.P.

David M Craig

Chien-Hua Chen

Charles Craig Haluzak

Ronald A Hellekson

Gary J Watts

Ronnie Yenchik

William R Boucher

Joshua W Smith

An apparatus includes a Micro Electrical Mechanical System (MEMS) having electrical contacts and a MEMS device in electrical communication with the electrical contacts. A lid is oriented over the MEMS device and not the electrical contacts. The lid has a base region and a top region, the base region being wider in dimension than the top region and oriented in closer proximity to the MEMS device than the top region.

Micro electrical mechanical system

A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

Electrically connecting substrate with electrical device

A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.

Method of forming a device package having edge interconnect pad

A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid, gel or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.

Micro-optoelectromechanical system packages for a light modulator and methods of making the same

This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.

An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.

Assembly with a ring and bonding pads formed of a same material on a substrate

A method for forming a light modulator includes supporting a plurality of optical devices on a substrate, and attaching a sheet of glass over the optical devices. The method also includes slicing the sheet of glass into a plurality of pieces of glass.

Light modulator

A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

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Albany, OR, United States of America

David M Craig