Sand 9, Inc.

Analog Devices,inc.

David M Chen

Guiti Zolfagharkhani

Jan H Kuypers

Alexei Gaidarzhy

Pritiraj Mohanty

Klaus Juergen Schoepf

Jason Goodelle

Reimund Rebel

Matthew J Crowley

Behraad Bahreyni

In one embodiment, an apparatus comprises a micromechanical gyroscope and a circuit. The micromechanical gyroscope is configured to be excited in a first mode by a drive signal, and configured to be excited in a second mode by a gyroscopic effect. The circuit is coupled to the micromechanical gyroscope and configured to detect the gyroscopic effect when the micromechanical gyroscope is in the second mode.

Microelectromechanical gyroscopes and related apparatus and methods

Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.

Mechanical resonating structures including a temperature compensation structure

Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Integration of piezoelectric materials with substrates

Microelectromechanical systems (MEMS) resonators and related apparatus and methods

Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. The compensating structure may have multiple layers, one of which may have a stiffness that increases with increasing temperature and one of which may have a stiffness that decreases with increases in temperature.

Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.

Methods and apparatus for mechanical resonating structures

Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.

Multi-port mechanical resonating devices and related methods

An apparatus is described that includes a substrate having a first plate and a second plate. The first plate and the second plate collectively have a first mode when excited by a drive signal and have a second mode when excited by a gyroscopic effect. The first and second plates each include a temperature-compensated stack having first and third layers that have a stiffness that increases with increasing temperature over a temperature range with a second layer between the first and third layers, where the second layer is formed from a different material than the first and third layers.

Passivated micromechanical resonators and related methods are described. Applicants have appreciated that polycrystalline conductive layers used as electrodes for some MEMS resonators are a source of mechanical and electrical instability. To inhibit or prevent contamination of such conductive layers, which may exacerbate the instabilities, passivation structures are used. The passivation structures can be grown, deposited, or otherwise formed.

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Brookline, MA, United States of America

David M Chen