Eastman-Kodak Company

David M Cama

Anthony G Chinnici

An eject interface for a removable peripheral used in an electronic device such as an electronic camera includes an eject mechanism for removably receiving the peripheral, a shield for enclosing at least part of the eject mechanism in order to isolate the peripheral from EMI generated by the camera, and a grounding connection on the shield for grounding the shield to a circuit ground on the camera.

EMI-protected eject interface for an electronic device

A shielded communications interface located within an electronic device is disclosed. The shielded communications interface is adapted to be connected to a plug of a peripheral external device and is subject to electromagnetic emissions (EMI) from electronic circuits which are grounded in the electronic device. The electronic device includes an enclosure having an opening through which the electronic circuits are accessed and a conductive inner wall surface that is connected to the ground of the electronic circuits. The shielded communications interface comprises a connector including a conductive housing and a plurality of pins which establish electrical connection between the plug and the electronic circuits, and a conductive EMI shield extending at least partially around the conductive housing. The conductive EMI shield is fastened to the conductive inner wall surface to thereby ground the conductive EMI shield and isolate EMI emissions generated by the electronic circuits in the electronic device from the connector.

EMI-shielded connector in an electronic device

A camera includes a lens arranged on an optical axis for focusing an image upon a focal plane bounded by rails that define a reference for locating an imaging medium relative to the focal plane, an electronic image sensor, and an imager mounting plate supporting the image sensor against the rails in the focal plane. By including on one or more of the rails a plurality of alignment holes that are precisely located relative to the optical axis, and a like plurality of locating pins on the imager mounting plate, the pins on the mounting plate locate into the corresponding holes in the film rails to center the image sensor with respect to the optical axis at the focal plane.

Focal plane mounting for an image sensor

A housing for at least one removable memory package includes a connector section having a contact array for connecting to the package and an enclosure coupled to and extending from the connector section for supporting the package for connection to the connector section. The housing further includes an ejection mechanism for ejecting the package outwardly from the enclosure and an ejection release button, which is connected to the ejection mechanism for initiating ejection of the package and supported for movement in a direction that is approximately perpendicular to the ejecting package. By locating the ejection release button at the front surface of the eject mechanism, and sliding the eject button in a direction perpendicular to the direction of the ejecting package, the eject mechanism can be of narrow width.

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Macedon, NY, United States of America

David M Cama