Hewlett-packard Development Company, L.p.

David M Braun

Siddhartha Bhowmik

Swaroop K Kommera

Richard J Oram

Sriram Ramamoorthi

Deanna J Bergstrom

Joshua W Smith

Christopher C Aschoff

Phillip G Rourke

Philip G Rourke

Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.

Print head die slot ribs

A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.

Formation of a slot in a silicon substrate

Mircodevice processing systems. One exemplary embodiment includes a component for removing substrate material to form a feature into a first surface of a substrate, and a component for measuring a thickness of a portion of the substrate defining the feature, wherein the component for measuring is positioned proximate a second surface of the substrate that is different than the first surface.

Microdevice processing systems and methods

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Corvallis, OR, United States of America

David M Braun