International Business Machines Corporation

David M Arken

Wen-Chien David Hsiao

Joseph John Fatula, Jr

Yiping Hsiao

Andrew Chiu

Robert William Hitzfield

A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.

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San Jose, CA, United States of America

David M Arken