Lam Research Corporation

Lam Research Ag

David Lou

Reinhold Schwarzenbacher

Rafal Ryszard Dylewicz

Milan Pliska

Hongzhi Wang

Angela Hecke

Xia Man

Kenichi Sano

The present invention relates to an etchant composition, in particular to an aqueous masking layer etchant composition for use in the removal of tungsten-doped carbon masking layers from a surface of a substrate, such as a semiconductor wafer. The composition comprises (a) 10 to 40 wt. %, based on the total weight of the composition, of hydrogen peroxide; and (b) 0.1 to 2.0 wt. %, based on the total weight of the composition, of one or more corrosion inhibitors.

Etchant composition

A system for reducing surface and embedded charge in a substrate includes a substrate support configured to support a substrate. A vacuum ultraviolet (VUV) assembly is arranged adjacent to the substrate and includes a housing and a VUV lamp that is connected to the housing and that generates and directs ultraviolet (UV) light at the substrate. A movement device is configured to move at least one of the VUV assembly and the substrate support during exposure of the substrate to the UV light to reduce surface and embedded charge in the substrate.

Reduction of surface and embedded substrate charge by controlled exposure to vacuum ultraviolet (VUV) light in low-oxygen environment

Growing community of inventors

Villach, Austria

David Lou