International Business Machines Corporation

David Lokken-Toyli

Corrado P Mancini

Kathryn Turner Schonenberg

Gerald Warren Gibson, Jr

Oliver Dial

Jiri Stehlik

Michael Karunendra Selvanayagam

Devin Underwood

Shayne Cairns

A superconducting electrical device includes one or more traveling-wave parametric amplifiers (TWPAs) on a chip that is electrically connected to a wiring layer of a substrate. The electrical connection of the chip to the wiring layer of the substrate includes, for each of the one or more TWPAs, a signal bump-bond between the TWPA and the substrate. There is a peripheral ring of ground bumps around the signal bump between the TWPA and the substrate.

High density interconnects for arrays of Josephson traveling wave parametric devices

A quantum circuit device includes a qubit chip including a plurality of qubits and a plurality of flux tunable couplers. A plurality of fixed frequency qubits are arranged in in a lattice structure, wherein each pair of the plurality of fixed frequency qubits is coupled to one flux tunable coupler. A wiring layer is coupled to the qubit chip, and the wiring layer includes a loop constructed of a superconducting material that is inductively coupled to the flux tunable couplers. A flux bias line is constructed of a superconducting material that is different than the superconducting material of the loop, wherein the flux bias line is inductively coupled to both the loop and the flux tunable couplers.

Generating DC offsets in flux-tunable transmons with persistent current loops

A method of manufacturing a travelling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched away through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of capacitors defined by a metal and a dielectric material that remains from the etched away metal surface and the layer of dielectric material.

Low loss travelling wave parametric devices using planar capacitors

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White Plains, NY, United States of America

David Lokken-Toyli