International Business Machines Corporation

Globalfoundries Inc.

Other

David Lewis Gardell

David Michael Audette

Dustin M Fregeau

Grant W Wagner

Marc Douglas Knox

Peter W Neff

Frederick H Roy, Iii

Jody John Van Horn

Paul M Gaschke

Normand Cote

Charles Hampton Perry

Dennis R Conti

Roger G Gamache, Jr

Timothy Dooling Sullivan

Jeffrey Donald Gelorme

George Frederick Walker

James Marc Leas

James N Humenik

Laura Louise Kosbar

Mark S Chace

Keith C Stevens

Ronald J Prilik

James M Crafts

Joseph K V Comeau

Mark R LaForce

John F Hagios

James R Salimeno, Iii

Robert William Koss

George J Lawson

Paul J Aube

Denis D Turcotte

Dennis M Bronson, Jr

Steve Leo Dingle

Roger R Schmidt

Govindarajan Natarajan

Raschid Jose Bezama

Steven Alan Cordes

Krishna Gandhi Sachdev

Sushumna Iruvanti

Dennis R Barringer

John Saunders Corbin, Jr

Stephen Peter Ayotte

Jose Arturo Garza, Jr

Anthony M Palagonia

Howard Victor Mahaney, Jr

Brian Michael Erwin

Rajneesh Kumar

Charles L Reynolds

Wade H White

David Craig Strippe

Kenneth Carl Larsen

Steven E Gardell

John Joseph Salazar

Jiali Wu

Mohammed S Shaikh

Kathryn C Rivera

Richard James Evans

Harold Wayne Chase

Gary H Irish

Joseph J Van Horn

Christopher L Sullivan

Francis E Froebel

Sankeerth Rajalingam

Lonnie J Cannon

Sukjay J Chey

Anthony D Fortin

Philip J Diesing

Harbans Singh Sachdev, Legal Representative

John R Maher

G John Lawson

Tuknekah M Noble

Craig M Bocash

Thomas W Bachelder

Randall J Bertrand

Guy C Morin

Yvonne Morris

Krisztian Gaspar

Ethan E Gallagher

Eric W Gardell

Robert F Groves

Peter J Demko

Lynda L Eaton

Paul H Boileau

Roger Gamache

Jeffrey Frank Kutner

Andrew T Holle

Adrian Patrascu

Edward J Sukuskas

Daniel J Murphy

John A Fredeman

Marvin G L Montaque

John Lawson

A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Probe card assembly

A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.

Repairable rigid test probe card assembly

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

Solder bump array probe tip structure for laser cleaning

Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

Gimbal assembly test system and method

A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.

Multiple contact probe head disassembly method and system

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

Organic probe substrate

The disclosure describes a probe card assembly for nondestructive integrated circuit testing. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Test equipment provides interrupt capability to automatic testing as a means of actively controlling temperature of the device under test. A processor coupled to memory is responsive to computer-executable instructions contained in the memory. A test socket is coupled to a device under test and coupled to the processor. The processor is configured to interrupt an application pattern running on the device under test. In response to interrupting the application pattern, the processor is configured to cause a control pattern to run on the device under test and then cause the application pattern to restart running from the point of interruption on the device under test.

Programmable active thermal control

Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.

Methodologies and test configurations for testing thermal interface materials

A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit.

Rigid probe with compliant characteristics

A method of probing compliant bumps of a circuit with probes is described. The method includes disposing the probes on a substrate, a base of each of the probes being coupled to the substrate. The method also includes disposing the circuit such that each of the compliant bumps is in contact with the probe tip of a corresponding one of the probes, each probe tip being connected to each base of each probe through a cantilever, and supplying current to the probes to test the circuit.

A testing apparatus for measuring the material properties of solder balls includes a frame and a chuck base moveable in X, Y, Z dimensions, relative to the frame. A probe tip is fixed to the frame. A measuring device is mounted to the frame and maintains a spacing with relationship to the probe tip and which has an initial, known height above the chuck base.

Solder bump testing apparatus and methods of use

Growing community of inventors

Fairfax, VT, United States of America

David Lewis Gardell