Other

Lucent Technologies Inc.

David Leonard Stevens

Allen Frank Rozman

Robert Joseph Roessler

William Lonzo Woods, Jr

Matthew Anthony Wilkowski

Randy T Heinrich

Cecil G Holt

John Leland Speight

Iboynne M Anderson

Toby D Baker

Jeff Salmon

The present invention includes a plant holding unit for supporting a plant on a generally vertical member. A plant container held by plant holding unit is held below a plane approximately normal to the outer surface of the generally vertical member. The plant holding unit is configured to support a plant container on a generally vertical member. The plant holding unit includes an opening having an axis and a perimeter edge, wherein the axis is approximately perpendicular to the first plane defining a general direction of plant growth. The plant holding unit also includes a barrier extending generally vertically from and attached to the perimeter edge, wherein the barrier forms a water retaining area.

Plant holding unit

Process to use water, methyl alcohol, and baking soda to make hydrogen and oxygen to increase fuel mileage on gasoline, diesel and LP gas engines using the process generally known as 'Electrolysis' with many modifications. A device and method for producing hydrogen and oxygen gases from Water Solutions and simultaneously using the gases produced to supplement fuels used to operate the vehicle or engine. The solution used in the Electrolytic container is water and sodium bicarbonate. The hydrogen and oxygen&#x2014;producing device is powered by as many as 5,500 amperes, generator or alternator, using the vehicle engine alternator or generator to produce the current to power the electrolytic cell. The electrolytic container is kept at a constant solution level. The water solution temperature may be controlled by either a low-pressure air conditioning line, a water-cooling line with a thermostatic control valve, on-off temperature control switch or water-cooling fins. The electrolytic cell is equipped with means to control the energy load, water level, gas flow and presenting the hydrogen and oxygen into the combustion chamber of the vehicle and or the engine.

Water fuel convertor

A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allows the power supply to be coupled to a printed wiring board.

Thermally conductive case for electrical components and method of manufacture therefor

An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation. The method comprises the steps of: (a) providing at least one aperture through the substrate for accommodating the traversing by the core structure; each respective aperture having a circumjacent face extending a height substantially equal with the substrate thickness; (b) providing a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture; and (c) assembling the electrical device in the installed orientation. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the aperture in the installed orientation.

Apparatus and method for facilitating heat dissipation in an electrical device

A package for an electrical apparatus is disclosed. The electrical apparatus includes a plurality of electrical components; the package comprises: (a) a first circuit board having a top side and a bottom side, and having a first array of the plurality of components arranged on at least one side of the top side and the bottom side; (b) a second circuit board in electrical and mechanical connection with the first circuit board; the second circuit board has a first side and a second side. The first side faces the top side of the first circuit board. The second circuit board has a second array of the plurality of components arranged on the first side. The second circuit board preferably has at least one heat dissipating structure substantially integrally affixed on the second side. Preferably, the second side is a metal substrate and the first side is electrically insulated from the second side. The package may further include one circuit board presenting an integral connection structure extending a standoff distance measured substantially perpendicular to the plane of the circuit board. The connection structure is affixed with the other circuit board when the package is in an assembled orientation. The method for manufacturing the apparatus comprises the steps of: (a) providing an insulated metal substrate presenting a first component bearing side and a second metallic side electrically insulated from each other; (b) providing a heat dissipating structure; and (c) substantially integrally affixing the heat dissipating structure with the substrate at the second side.

Package for an electrical apparatus and method of manufacturing therefore

A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered. The present invention provides a highly compact, thermally conductive package for a power supply module (perhaps a DC/DC converter) that is cost effective, readily manufacturable, durable, and easily mounted to a circuit card, allowing the power module to, for example, form a portion of a distributed power architecture.

Board-mountable power supply module

A power supply and a method of manufacture therefor. The power supply includes: (1) a circuit board containing conductors for interconnecting electrical components of the power supply, (2) a thermally-conductive case having an integral electrically insulating layer, the thermally-conductive case forming a reservoir to receive the circuit board therein, (3) a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board, (4) an encapsulant, located within the reservoir, the encapsulant ensconcing the power semiconductor device and the electrical components and (5) electrical leads extending from the power supply that allow the power supply to be coupled to a printed wiring board.

Encapsulated, board-mountable power supply and method of manufacture

A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allow the power supply to be coupled to a printed wiring board.

The present invention provides for use with a circuit board having an aperture formed therein for receiving an electrical component therethrough, an electrical component assembling device. The electrical component device, in a preferred embodiment, includes a body member configured to receive the electrical component and at least partially extend through the aperture. A first clip is coupled to the body member and includes a first pressure bearing member for exerting a force against the circuit board to thereby secure the body member to the circuit board. The device further includes a second clip coupled to the body member. The second clip also includes a second pressure bearing member for exerting a force against the electrical component to thereby secure the electrical component to the body member. Thus, the first and second clips act in concert to hold the electrical component and the body member secure with respect to the circuit board.

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Mesquite, TX, United States of America

David Leonard Stevens