Sonetics Ultrasound, Inc.

University of Michigan

Bliley Technologies, Inc.

David Lemmerhirt

Collin Anderson Rich

Kensall D Wise

Onnop Srivannavit

Jay Mitchell

A system is provided for providing vibration isolation and acceleration compensation for a device such as a vibration-sensitive oscillator or sensor. The system has an assembly that moves or vibrates relative to an external component. The assembly includes a plurality of components mounted to either side of a PCB. One or more accelerometers are configured to detect acceleration of the PCB in at least one of an X-axis direction, a Y-axis direction, and a Z-axis direction. The system includes plurality of isolators coupled to the assembly and configured to isolate or dampen vibrations that would otherwise transfer to the assembly from an underlying component to which the assembly is configured to attach to. In certain embodiments, the isolators are located between the assembly and the underlying component within vertical confines of an exterior perimeter of the PCB.

Vibration isolator platform with electronic acceleration compensation

A method and system for using ultrasound for evaluating pressure of a vessel of a user, the method including: providing an ultrasound system configured to be placed at a body region proximal the vessel of the user, generating a correlation between a set of push pulse parameters and a set of push pulse-dependent values associated with the vessel, wherein generating the correlation includes providing a push pulse and determining a push pulse-dependent value based on the push pulse, generating a pressure value from the vessel based on the correlation, and generating a pressure waveform from the pressure value and a set of supplemental pressure values.

Method and system for measuring blood pressure using ultrasound by emitting push pulse to a blood vessel

The first integrated circuit/transducer deviceof the handheld probe includes CMOS circuitsand cMUT elements. The cMUT elementsfunction to generate an ultrasonic beam, detect an ultrasonic echo, and output electrical signals, while the CMOS circuitsfunction to perform analog or digital operations on the electrical signals generated through operation of the cMUT elements. The manufacturing method for the first integrated circuit/transducer deviceof the preferred embodiment includes the steps of depositing the lower electrode S; depositing a sacrificial layer S; depositing a dielectric layer S; removing the sacrificial layer S, followed by the steps of depositing the upper electrode Sand depositing a protective layer on the upper electrode S

Capacitive micromachined ultrasonic transducer

The integrated circuit/transducer device of the preferred embodiment includes a substrate, a complementary-metal-oxide-semiconductor (CMOS) circuit that is fabricated on the substrate, and a capacitive micromachined ultrasonic transducer (cMUT) element that is also fabricated on the substrate. The CMOS circuit and cMUT element are fabricated during the same foundry process and are connected. The cMUT includes a lower electrode, an upper electrode, a membrane structure that support the upper electrode, and a cavity between the upper electrode and lower electrode.

Capacitive micromachined ultrasonic transducer and manufacturing method

A system and method for biasing a capacitive ultrasonic transducer (CMUT) device with a circuit that includes a CMUT that includes a first plate and a second plate that form a membrane structure; a circuit voltage source at a complementary metal-oxide-semiconductor (CMOS) compatible voltage; a bias voltage source that applies a bias voltage greater than a CMOS compatible voltage and is applied to the first plate; and readout electronics with an input connected on the second plate side of the circuit.

System and method for biasing CMUT elements

The first integrated circuit/transducer deviceof the handheld probe includes CMOS circuitsand cMUT elements. The cMUT elementsfunction to generate an ultrasonic beam, detect an ultrasonic echo, and output electrical signals, while the CMOS circuitsfunction to perform analog or digital operations on the electrical signals generated through operation of the cMUT elements. The manufacturing method for the first integrated circuit/transducer deviceof the preferred embodiment includes the steps of depositing the lower electrode S; depositing a sacrificial layer S; depositing a dielectric layer S; depositing the upper electrode S; depositing a protective layer on the upper electrode S; and removing the sacrificial layer S. In the preferred embodiment, the manufacturing method also includes the step of depositing a sealant layer to seal a cavity between the lower electrode and the upper electrode S

A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

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Ann Arbor, MI, United States of America

David Lemmerhirt