Osram Opto Semiconductors Gmbh

Osram Gmbh

David Lacey

Karl Pichler

Ewald Guenther

Hooi Bin Lim

Shi Chai Chong

Cheng Kooi Tan

Hagen Klausmann

An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.

Encapsulation for electroluminescent devices

An embodiment of the present invention pertains to encapsulating an organic electronic device by selectively depositing a catalyst layer and then exposing the catalyst layer to a monomer to produce a planarization layer. The monomer reacts only in the areas where the catalyst layer is present so there is minimal or no contamination of other areas of the organic electronic device. Selectively depositing the catalyst layer allows the resulting planarization layer to be patterned. A barrier layer is selectively deposited on at least the planarization layer. Another embodiment of the present invention pertains to encapsulating an organic electronic device by depositing a planarization layer on a transfer substrate and then allowing it to stabilize to minimize its reactivity. The planarization layer is transferred from the transfer substrate onto at least an active area of the organic electronic device. A barrier layer is selectively deposited on at least the planarization layer.

Encapsulation for organic electronic devices

Growing community of inventors

Mountain View, CA, United States of America

David Lacey