Ferro Corporation

David L Widlewski

Srinivasan Sridharan

John J Maloney

George E Sakoske

Jackie D Davis

Chandrashekhar Sadanand Khadilkar

Ellen Schwartz Tormey

Robert P Blonski

Yie-Shein Her

Mohammed H Megherhi

Stanley Wang

Cody J Gleason

Gregory R Prinzbach

Orville Washington Brown

Bradford Smith

Thomas Joseph Coffey

Peter Marley

A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950&#xb0; C. or below 1100&#xb0; C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO, 5-35 mole % or 0.1-35 mole % BO, 0.1-10 mole % or 0.1-25 mole % AlO, 0.1-10 mole % KO, 0.1-10 mole % NaO, 0.1-20 mole % LiO, 0.1-30 mole % F. The total amount of LiO+NaO+KO is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

Low K dielectric compositions for high frequency applications

A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500&#xb0; C. to 900&#xb0; C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.

Passivation glasses for semiconductor devices

Glasses comprising Bi203, ZnO B203 and optionally a colorant including an oxide of a metal such as iron, cobalt, manganese, nickel, copper and chromium are suitable to form hermetic seals in solar cell modules, architectural glass windows and MEMS devices. Glass frit and paste compositions suitable for flow and bonding to various substrates&#x2014;glass, metal, silicon, in the temperature range of 400-500 degrees Centigrade. The broad compositional range in mole % is 25-70% Bi203, up to 65% ZnO, and 1-70% B203. Such glasses do not have batched in alumina or silica. Such glasses lack alumina and silica.

Low-melting lead-free bismuth sealing glasses

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Parma Heights, OH, United States of America

David L Widlewski