Rohm & Haas Electronic Materials LLC

Shipley Company LLC

David L Jacques

Gary Hamm

Mark J Kapeckas

Maria Anna Rzeznik

Wade W Sonnenberg

Eugene N Step

John P Cahalen

Leon Barstad

Edward C Couble

Steven M Florio

Carl J Colangelo

Craig S Allen

George R Allardyce

Robert A Binstead

Raymond Cruz

Elie H Najjar

Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.

Enhanced method of forming nickel silicides

Methods of light induced plating of nickel onto semiconductors are disclosed. The methods involve applying light at an initial intensity for a limited amount of time followed by reducing the intensity of the light for the remainder of the plating period to deposit nickel on a semiconductor.

Method of light induced plating on semiconductors

Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed.

Method of inhibiting background plating

Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Plating bath analysis

Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Dielectric structure

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.

Electroplating process

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Northbridge, MA, United States of America

David L Jacques