International Business Machines Corporation

Other

Apple Inc.

David L Edwards

Sushumna Iruvanti

Hilton T Toy

Raed A Sherif

Glenn Graham Daves

Frank Louis Pompeo

Robert K Mullady

David Clifford Long

Patrick Anthony Coico

Gaetano Paolo Messina

Mark G Courtney

Donald W Porter

Randy J Zoodsma

Lewis Sigmund Goldmann

Ronald L Hering

Stephen S Drofitz, Jr

Gregory Scott Hopper

Charles Frederick Jones

Albert Joseph Fahey

Shaji Farooq

Jason Scott Miller

Wei Zou

Mukta G Farooq

Da-Yuan Shih

John G Torok

Kamal Kumar Sikka

Gary Franklin Goth

Francis R Krug, Jr

Daniel J Kearney

Thomas J Fleischman

Allan C VanDeventer

Randall G Kemink

Peter W Kelly

David J Womac

Paul A Zucco

Frank M Desiano

Michael J Ellsworth, Jr

Evan G Colgan

Peter Alfred Gruber

Benjamin V Fasano

Jeffrey Allen Zitz

Subhash Laxman Shinde

Lester W Herron

Shawn Canfield

Norman J Dauerer

Peter Jeffrey Brofman

Richard Francis Indyk

David B Goland

William Edward Sablinski

Lannie R Bolde

Robert R Genest

Giulio DiGiacomo

Ajay Prabhakar Giri

Mark A Brandon

David Charles Olson

James H Covell

Jeffrey Thomas Coffin

Armando S Cammarano

Larry D Gross

Kevin A Dore

Roger R Schmidt

Theodore Gerard Van Kessel

Michael A Gaynes

William Louis Brodsky

Supratik Guha

Yves Corfield Martin

Prabjit Singh

James A Busby

Sung Kwon Kang

Bruce Kenneth Furman

Bruce John Chamberlin

Michael D Hillman

Steven Paul Ostrander

John Saunders Corbin, Jr

Michael Sean June

Kenneth Charles Marston

Donald W Henderson

Gregory L Tice

Carl R Peterson

Robin A Susko

Jennifer V Muncy

Jiantao Zheng

Richard Lidio Blanco

Katie L Pizzolato

Martin Beaumier

Ronald Jack Smith

Sean A Bailey

Phillip Lee Mort

Scott A Cummings

Michael J Emmett

Richard F Shortt

Michael J Griffin, Iv

Ellyn M Ingalls

Mohamed Belazzouz

Giulio Di Giacomo

Jaimal M Williamson

Barrie C Campbell

Enrique C Abreu

Portable holders for supporting lottery tickets and the scratching off of coatings therefrom. In some embodiments, the holders may include substantially planar surfaces having top edges, bottom edges, left side edges, and right side edges, the top edges being opposite to the bottom edges, and the left side edges being parallel and opposite to the right side edges; at least one slot and/or notch disposed along the surfaces and configured to hold lottery tickets on the surfaces; and trays attached to the bottom edges of the surfaces and configured to collect particulates there within.

Portable lottery ticket holder

A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Cooling system with integrated fill and drain pump

Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Liquid-cooled heat sink configured to facilitate drainage

A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

System to improve an in-line memory module

A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.

Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics

A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

Thermal paste containment for semiconductor modules

The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor module between a lower power state such as a zero power, nap or sleep state and a full power state over a predetermined time period. This allows the rate of movement and strain rate of the thermal interface material within the semiconductor module to be controlled, thus preserving the reliability of the material. Typically, the power is changed over time between the lower power state and the full power state in a linear fashion or incrementally.

Controlling power change for a semiconductor module to preserve thermal interface therein

A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

Solder interconnection array with optimal mechanical integrity

A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive. After the thermal interface material has and adhesive have cured, the method removes the force from near the distal ends of the lid or substrate to cause the center portion of the lid to return to a position closer to the semiconductor chip, creating a residual compressive stress in the thermal interface material thus improving thermal performance and thermal reliability.

Lid edge capping load

Growing community of inventors

Poughkeepsie, NY, United States of America

David L Edwards