Power-one Limited

Power-one A.g.

David Keating

Antoin Russell

Mysore Purushotham Divakar

Thomas H Templeton, Jr

John Alan Maxwell

The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of electrically conductive material, such as copper, and may be mounted within a lead frame package or directly onto a circuit board. The lead frame substrate includes mounting surfaces adapted to receive the semiconductor dice and passive components. The mounting surfaces are linked together by temporary and/or permanent connection bars. A method to manufacture the lead frame package includes, among other steps, forming a lead frame substrate, applying a molding compound to the lead frame substrate to fix each mounting surface and connection bar in place, removing the temporary connection bars, mounting the semiconductor components on the lead frame substrate, and applying a packaging material over the lead frame substrate to encapsulate the semiconductor components.

Micro lead frame package

The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By 'vertically mounting' is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board

The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

Arrangement for surface mounting of subassemblies on a mother board

A semiconductor chip package that includes a DC&#x2014;DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC&#x2014;DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array. The land grid array includes external pads that are separated into an interior region and a peripheral region. Each external pad located in the interior region of the land grid array is electrically and thermally coupled a via array.

DC-DC converter implemented in a land grid array package

In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By 'vertically mounting' is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board. With this mounting, problems of co-plurality are substantially eliminated, higher densities in the use of subassemblies can be achieved and low resistance, low inductance connection can be provided along with effective heat dissipation.

Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same

A semiconductor chip package that includes a DC&#x2014;DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC&#x2014;DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC&#x2014;DC converter provided on the substrate. The DC&#x2014;DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC&#x2014;DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC&#x2014;DC converter is conducted out of the LGA package through the plurality of pads.

The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By &ldquo;vertically mounting&rdquo; is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. A pickup cap attached at the board edge opposite the base permits pick-and-place positioning of the subassembly by conventional equipment without the need for special grippers.

Arrangement for co-planar vertical surface mounting of subassemblies on a mother board

A carrier board which has a plurality of conduction layers is provided. A plurality of electronic units are produced on surface regions of the board with electronic components arranged at regular spacing. The surface regions, for use in a separation operation, are held at predetermined separating regions to a frame. The frame has an externally contactable, connecting region for an operating voltage or load for electronic units. Each electronic unit can be acted upon with the operating voltage or a load, by way of supply, load and/or signal lines in the frame and at separating regions of the carrier board. The electronic units can be operated and tested by the supply as well as the load and/or signal lines in a full-load mode of operation.

Growing community of inventors

Limerick, Ireland

David Keating