Intel Corporation

David K Wilkinson, Jr

Yoshihiro Tomita

Edward Rudolph Prack

Sergei L Voronov

Rajen C Dias

Mihir A Oka

Tony Dambrauskas

Lars D Skoglund

Danish Faruqui

Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or 'inactive' side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

Laser die backside film removal for integrated circuit (IC) packaging

Growing community of inventors

Scottsdale, AZ, United States of America

David K Wilkinson, Jr