Micron Technology Incorporated

Round Rock Research, LLC

Keystone Technology Solutions, LLC

Micron Communications, Inc.

Omnipoint Corporation

David K Ovard

George Edward Pax

Roy Edgar Greeff

John R Tuttle

Mark E Tuttle

James E O'Toole

Brian P Higgins

Kevin M Devereaux

Tyler A Lowrey

Robert R Rotzoll

Shu-Sun Yu

Timothy Mowry Hollis

Terry R Lee

Scott T Trosper

Mark T Van Horn

Walter L Moden

Thomas Hein

Brent Keeth

Troy A Manning

Brian L Johnson

Victor Y Tsai

Ronnie M Harrison

Joo S Choi

Aparna U Limaye

Dragos Dimitriu

Robert N Leibowitz

Freddie W Smith

Greg King

M Ataul Karim

Roy Greef

Ryan N Jensen

Dirgha Khatri

Tyler A Lowery

Cliff Wood, Jr

Robert N Bowitz

Methods, systems, and devices for crosstalk cancellation for signal lines are described. In some examples, a device (e.g., a host device or a memory device) may generate a first signal and may invert the first signal to obtain an inverted first signal. The device may obtain a second signal based on attenuating a first range of frequencies of the inverted first signal and a second range of frequencies of the inverted first signal, where the first range of frequencies is below a first threshold frequency and the second range of frequencies is above a second threshold frequency that is greater than the first threshold frequency. The device may transmit the first signal via a first signal line of a set of signal lines and the second signal line via a second signal line of the set of signal lines.

Crosstalk cancellation for signal lines

Systems may include a central processing unit (CPU), a graphics processing unit (GPU), or a field programmable gate array (FPGA), or any combination thereof. At least one memory device may be connected to the CPU, the GPU, or the FPGA. The memory device(s) may include a device substrate including a microelectronic device and bond pads coupled with an active surface of the device substrate. A package substrate may be secured to the device substrate, the package substrate configured to route signals to and from the bond pads. A ball grid array may be supported on the package substrate. Each ball of the ball grid array positioned and configured to carry one of a high-bandwidth data signal or a high-frequency clock signal may be located only diagonally adjacent to any other balls of the ball grid array configured to carry another of a high-bandwidth data signal or a high-frequency clock signal.

Apparatuses including ball grid arrays and associated systems

Apparatuses may include a device substrate including a microelectronic device and bond pads proximate to an active surface of the device substrate. A package substrate may be secured to the device substrate, the package substrate configured to route signals to and from the bond pads. A ball grid array may be supported on, and electrically connected to, the package substrate. Each ball positioned and configured to carry a high-bandwidth data signal or a high-frequency clock signal may be located laterally or longitudinally adjacent to no more than one other ball of the ball grid array configured to carry a high-bandwidth data signal or a high-frequency clock signal. Each ball positioned and configured to carry a high-bandwidth data signal may be located only diagonally adjacent to any other balls configured to carry a high-bandwidth data signal or a high-frequency clock signal.

Apparatuses including ball grid arrays and associated systems and methods

Ball grid arrays and associated apparatuses and systems

Digital memory devices and systems, including memory systems and methods for operating such memory systems are disclosed. In the embodiments, a memory system may include a processor and a memory controller communicatively coupled to the processor. A memory bus communicates with at least two memory units through the memory bus. At least one divider unit may be interposed between the memory bus and the at least two memory units that is configured to approximately equally divide levels of received signals while matching an impedance of the memory bus to an impedance of the memory units.

Enhanced performance memory systems and methods

The present invention provides backscatter interrogators, communication systems and backscatter communication methods. According to one aspect of the present invention, a backscatter interrogator includes a data path configured to communicate a data signal; a signal generator configured to generate a carrier signal; and a modulator coupled with the data path and the signal generator, the modulator being configured to spread the data signal to define a spread data signal and amplitude modulate the carrier signal using the spread data signal, the modulator being further configured to phase modulate the carrier signal.

Methods and apparatus for RFID tag communications

A memory module is coupled to a number of controllers. The memory module is configured to configure each of a number of data input/output ports thereof as at least one of an input and an output in response to a first command from a particular controller of the controllers. The memory module is configured to partition itself into memory partitions in response to a second command from the particular controller so that each memory partition corresponds to a respective one of the controllers. Each of a number of data input/output ports of the controllers is configurable as at least one of an input and an output to correspond to a respective one of the input/output ports of the memory module. The first and second commands may originate from the particular controller, or the controllers may be coupled in parallel to the memory module.

Memory module with configurable input/output ports

The present invention relates to wireless communication systems, interrogators and methods of communicating within a wireless communication system. One aspect of the present invention provides a wireless communication system including at least one remote communication device configured to communicate a return link wireless signal; an interrogator including: a communication station configured to receive the return link wireless signal and to generate a return link communication signal corresponding to the return link wireless signal; communication circuitry coupled with the communication station and configured to communicate the return link communication signal; and a housing remotely located with respect to the communication station and including circuitry configured to receive the return link communication signal from the communication circuitry and to process the return link communication signal.

Wireless communication systems, interrogators and methods of communication within a wireless communication system

Aspects of a communication system include phase shifters, interrogators, methods of shifting a phase angle of a signal, and methods of operating an interrogator. One example provides a phase shifter that include a first power divider configured to receive a signal and provide plural quadrature components of the signal; plural mixers coupled with the first power divider and configured to scale the quadrature components using a phase shift angle; and a second power divider coupled with the mixers and configured to combine the scaled quadrature components to shift the phase angle of the input signal by the phase shift angle.

Phase shifters, interrogators, methods of shifting a phase angle of a signal, and methods of operating an interrogator

A memory module has one or more memory devices, a controller in communication with the one or more memory devices, and a plurality of input/output ports. The controller is configured to configure each input/output port as an input, an output, or a bidirectional input/output.

A radio frequency identification (RFID) device includes an antenna linked to a receiving circuit, the antenna tuned to receive a radio frequency (RF) time-code signal from a public source, a controller circuit and an internal clock linked to the receiving circuit, a microcontroller linked to the receiving circuit, a memory linked to the microcontroller, and a battery linked to and powering the receiving circuit, controller circuit, internal clock, microcontroller and memory.

RFID device time synchronization from a public source

The present invention includes backscatter communication systems, interrogators, methods of communicating in a backscatter system, and backscatter communication methods. According to one aspect of the present invention, a backscatter communication system includes an interrogator including a transmitter configured to output a forward link communication and a receiver configured to receive a return link communication having a carrier signal, the receiver being configured to reduce the amplitude of the carrier signal of the return link communication; and a communication device configured to modulate the carrier signal to communicate the return link communication responsive to reception of the forward link communication.

Communication system, interrogators and communication methods

Growing community of inventors

Meridian, ID, United States of America

David K Ovard