Hewlett-packard Company

Hewlett-packard Development Company, L.P.

David K Mc Elfresh

Joseph Edward Scheffelin

Mohammad Akhavain

Janis Horvath

Brian J Keefe

Lawrence E Gibson

Gerald Vincent Rapp

Byron K Davis

Robert-Scott Melendrino Lopez

A printhead assembly includes a carrier including a substrate and a substructure joined to a first surface of the substrate, and a plurality of printhead dies each mounted on a second surface of the substrate. The first surface of the substrate includes a surface deformation and the substructure is joined to the first surface by an adhesive. As such, the adhesive conforms to the surface deformation.

Surface deformation of carrier for printhead dies

A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

Inkjet printhead assembly having planarized mounting layer for printhead dies

A carrier adapted to support at least one printhead die includes a substrate having at least one surface and at least one datum attached to the at least one surface of the substrate. The substrate includes a first material and the at least one datum is formed from a blank including a second material. As such, the at least one datum is adapted to position the carrier in at least one dimension.

Reference datums for inkjet printhead assembly

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San Diego, CA, United States of America

David K Mc Elfresh