Sun Microsystems, Inc.

David K Kim

William W Ruckman

Ronald L Barnes

Barry Marshall

Wenjun Chen

Brett C Ong

Anthony Kozaczuk

Talal Ahwal

Mohsen Saneinejad

Mark H Waters

Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.

Computer system layout and cooling configuration

Disclosed are novel methods and apparatus for provision of an efficient, effective, and/or flexible removable HDD cartridge. In accordance with an embodiment of the present invention, an apparatus for holding a removable assembly () is disclosed. The apparatus comprising: a cage () to hold the assembly, a cage bracket () slideably engaging the cage (), and a latch () coupled to the cage. The cage may include a plurality of slide receptacles (). The assembly may include a plurality of slides () slideably engaging the plurality of slide receptacles (). The cage bracket may be mountable on an external device. The latch may include a latch cap () and a locking lip (). The locking lip may engage a receptacle () on the cage bracket to lock together the cage bracket and the cage.

Tool-less modular removable hard disk drive (HDD) apparatus

A method and apparatus for providing an EMI seal in a system chassis. The EMI seal is provided by a bezel assembly for a storage medium drive. The bezel assembly includes a front bezel having an aperture through which a tray can extend for loading and unloading of the storage medium drive, and a tray bezel attached to the tray. Attached to the front bezel is an electrically conductive link. Both the front bezel and the tray bezel include an electrically conductive inner surface. Upon closing the tray, the electrically conductive link provides an electrical connection between the inner surface front bezel and the inner surface of the tray bezel.

EMI seal for system chassis

A module consists of a shroud or enclosure attached to a card containing heat-emitting electronic components or to a stack of two or more vertically spaced cards; one or all of which have heat sinks in thermal contact with at least some of the electronic components. The shroud is apertured to control air flow in many directions over the components and heatsinks. A hinge member extends along one edge of the module shaped to be inserted in a slot in a panel to establish a hinge. As the shroud is pivoted about the hinge, horizontal electrical contacts on the panel and at least one card interengage and vertical contacts on one of the cards remote from the hinge simultaneously interengage. The contour of the shroud aids in installing or removing the module.

Module of enclosure for electronic cards

A heat transmitting slug is attached to a chip or other heat emitting electronic component by an adhesive. A heat sink is mounted on the slug by one or more screws or other fasteners, preferably with thermal grease between the bottom of the heat sink base and the top of the slug. The top of the slug is formed with a longitudinal tongue and the base of the heat sink with a mating groove. Preferably the base of the heat sink is offset upwardly above the groove to resist tendency to fracture under stress.

Interfitting heat sink and heat spreader slug

A heatsink is pressure compliantly mounted against a substrate-mounted packaged electronic device such that the heatsink is not readily dislodged from the device package. A layer of pressure-compliant elastomeric foam material is sandwiched between the upper surface of the heatsink and an overlying shroud, which biases the heatsink downward toward the packaged device, which may be a BGA-packaged device. The lower heatsink surface is attached to the upper device package surface with double-sided thermal tape, and the shroud is attached to the substrate and compressively but compliantly urges each heatsink into more intimate thermal contact with an underlying device. The pressure-compliant material compensates for dimensional vertical tolerances associated with the substrate-mounted devices and heatsinks, while dampening vibrations and minimizing stress and torque that could otherwise damage the devices and/or the integrity of their electrical connections to the substrate.

Growing community of inventors

San Jose, CA, United States of America

David K Kim