Sun Microsystems, Inc.

David K J Kim

William W Ruckman

Dimitry Struve

Marcus Adams

Sven Larson

An apparatus for reducing shielding gaps associated with the mounting of peripheral cards in a computer system. A computer system chassis includes a frame mounted thereupon, the frame having at least one opening adjacent to a peripheral card slot. The frame includes a plurality of tabs arranged around the opening, wherein the tabs on one side of the opening are staggered with respect to the tabs on the other side of the opening. A shield bracket configured for coupling to a peripheral card mountable in the slot is slidable to cover the opening. When the shield bracket is slid into position to cover the opening, the shield bracket is retained by the plurality of tabs. The frame and the slot bracket are made of a flexible, electrically conductive material.

Slot frame with guide tabs for reducing EMI gaps

A thermal control apparatus using heat pipes. The thermal control apparatus includes a heat pipe having a hollow interior at least partially filled with a vaporizable liquid. The heat pipe further includes a threaded outer surface configured for coupling the heat pipe into an aperture having a threaded inner surface. The threaded outer surface maybe an integral portion of the heat pipe, or may be implemented using a separate piece that coupled to the heat pipe. A thermal control apparatus using the heat pipes may be implemented with a heat spreader having one or more apertures, wherein each of the apertures includes a threaded inner surface. A heat pipe having a threaded outer surface may be positioned in one of the apertures. The thermal control apparatus may be mounted on a printed circuit board in the proximity of one or more electronic components.

Thermal control apparatus for electronic systems

The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment is a riser card bracket assembly for an electronic system. The riser card bracket comprises an adjustable card retainer disposed within the riser card bracket assembly; the retainer is capable of movement within the riser card bracket assembly to secure cards of various lengths. Another embodiment of the invention is a method for installing cards within a computer housing having a motherboard. The method comprises providing a riser card bracket assembly having an adjustable card retainer. At least one card is inserted within the riser card bracket assembly. The riser card bracket assembly is inserted within the computer housing whereby the at least one card is positioned parallel to the motherboard. A portion of the riser card bracket assembly is inserted into a connector located on the motherboard, thereby creating electrical connection between the card and the motherboard.

PCI riser card bracket assembly

An apparatus is disclosed for storing electronic devices. The apparatus includes an enclosure, a carrier adapted to contain a peripheral device, and a rotatable attachment between the carrier and the enclosure. The carrier may be rotated from an installed position to an open position. When in the installed position, a long axis of the carrier is substantially parallel to a front of the enclosure. When in the open position, the long axis of the carrier is substantially perpendicular to the front of the enclosure.

Peripheral device storage system

The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.

Method and apparatus for cooling electronic components

An electronic system may include a mounting structure that allows a switch to be firmly attached to the electronic system. The switch may have one or more snap lock mechanisms attached to a body of the switch. The mounting structure may have an opening sized to allow the switch and the snap lock mechanisms to be inserted into the mounting structure. The mounting structure may include an undercut portion in a wall of the mounting structure. The mounting panel may also include a channel configured to accept a width of the snap lock mechanism. The undercut portion of the wall may be located in a channel wall. When the switch is inserted into the mounting structure, the snap lock mechanism may engage the undercut portion of the mounting structure to securely hold the switch to the mounting structure.

Growing community of inventors

San Jose, CA, United States of America

David K J Kim