Morgan Advanced Ceramics Limited

The Morgan Crucible Company Plc

David Joseph Bealka

Fred M Kimock

Timothy J Brown

Christien Matthew Vaillancourt

Emma Claire Gill

Pedro Henrique Da Costa

Thomas W Shipman

Fred Michael Kimock

A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well as specific geometries and compositions are disclosed. Interconnects formed in this fashion enable significant reductions in overall size of the interconnect relative to the number of feedthrough leads as well as substantial improvements in robustness versus currently available technology.

Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same

A feedthrough device having a ground wire that is coupled to both a metallic ferrule and to an insulating material and methods of making the device are provided. The ground wire is coupled or brazed between, adjacent to, or otherwise in direct contact with the metallic ferrule and the insulating material, for example, in a gap between the insulating material and the ferrule, or directly to the side of the insulating material and abutting the surface of the ferrule. If the ground wire is coupled or brazed in a gap, the gap may be formed by a notch in either the insulating material, the ferrule or both.

Feedthrough devices

An electronic feed-through system that is adapted for use in situations in which the feed-through is bonded to a container or the like by a process that subjects the feed-through system to heating. The feed-through system includes an electrically conductive structure adapted to be attached to a second structure at a first location on the conductive structure. The conductive structure has an electrically conducting member connected to the first location. A portion of the conductive structure is subjected to heat during said attachment. The feed-through system also includes an electronic component such as a feed-through capacitor. The electronic component requires electrical connection to the conducting member and placement in proximate spaced relation to the conducting member. An electrically conducting thermally resistant bridge is used to connect the electronic component to the conducting member and maintain the component in the spaced relationship with the member.

High temperature feed-through system and method for making same

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East Freetown, MA, United States of America

David Joseph Bealka