Qualcomm Incorporated

David Jonathan Walshe

Bharani Chava

Baptiste Grave

Stefano Facchin

An IC is provided. The IC includes a power grid including Mlayer interconnects extending in a first direction on an Mlayer and Mlayer interconnects extending in a second direction orthogonal to the first direction on an Mlayer, where x&#x3e;5. In addition, the IC includes a plurality of power switches. Further, the IC includes at least one sensing element located between the Mlayer and the Mlayer and configured to measure a voltage drop to devices powered by the plurality of power switches. The one or more of the plurality of power switches may be located below the power grid. The power switches of the plurality of power switches may be adjacent in the first direction and in the second direction to each sensing element of the at least one sensing element.

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Cork, Ireland

David Jonathan Walshe