Harman International Industries, Inc.

David Jia

Jianing Chen

Jon Curry

Fan Wu

Valod Noshadi

Homero Garza

Alex Tzinares

Homero L Garza

A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to engage the panel. The base wall includes a plurality of tabs. Each tab configured to receive a corresponding fastener to secure the base wall to the panel.

Mounting structure for mounting an electronic device

Methods and systems for an electronic package for a vehicle are provided. In one example, the electronic package includes a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis, and a circuit board coupled to the chassis, wherein the bent tabs directly contact the circuit board.

Systems and methods for an electronic device

An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Electromagnetic compatibility contact between metal castings and printed circuit boards

The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.

Growing community of inventors

Houston, TX, United States of America

David Jia