Delphi Technologies, Inc.

Delco Electronics Corporation

David Jay Vess

Kevin J Hawes

Sean Michael Kelly

Shawn Shi

Joseph Howard Gladd

Bradley H Carter

Dwadasi Hare Rama Sarma

Richard A Natoli

Andres Eduardo Avila

Jerome Anthony Schneider

Przemyslaw Antos

Dominic Carano

A sensor assembly that integrates a camera and a radar sensor is described herein. The sensor assembly includes a housing configured to partially enclose the camera and the radar sensor, and define a partial radome that partially intrudes into the radar beam. The partial radome is configured such that after passing through the partial radome a first phase angle of the first portion of the radar beam differs from a second phase angle of the second portion of the radar beam by an amount substantially corresponding to an integer number of three hundred sixty degrees (360&#xb0;) of phase angle shift. The partial radome provides glare shield to the camera, protection to assembly, and is configured to minimally effect radar performance.

Partial covering radome for a radar unit

An anti-rattle sleeve that includes a retention feature on a split end that extends radially from the body portion and a slot configured to allow the retention feature to be pressed through an opening. The sleeve also includes a flange portion opposite the split end that includes an inner bump configured to contact a surface of an object bracket and an outer bump configured to contact a surface of a mounting bracket. The inner bump and the outer bump are located relative to the slot such that the sleeve is deformed by the brackets in a manner effective to reduce relative motion between the object bracket and the mounting bracket when compressed between the brackets.

Anti-rattle sleeve for a hinge joint

An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a bus wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the bus wires are laid, they will pass through the holes in the PCB and/or pass through the wire slots of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween. Additionally, the electrical interconnect system includes a flexible strain relief bend formed on the bus wire to provide a flexible connection.

Electrical interconnect system and method for integrating a bussed electrical distribution center with a printed circuit board

A method by which a conventional circuit trace (,) is modified with a layer (,) of high-conductivity solder alloy to yield a high-current circuit trace (,) for high-current routing on a substrate (,). The method generally entails the use of a solder composition that contains a dispersion of metal particles (,) in a solder alloy (,). The metal particles (,) are selected on the basis of having a higher electrical conductivity than the solder alloy (,), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (,). The solder composition is deposited on a conductor (,), and then reflowed to form a conductive layer (,) on the conductor (,). The metal particles (,) remain as a discrete dispersion within the conductive layer (,) in order to suitably promote the conductivity of the layer (,). The solder composition is preferably deposited in an amount sufficient to increase the current-carrying capacity of the resulting circuit trace (,) for high-current routing on the substrate (,), e.g., in excess of six amps.

High-current circuit trace and composition and method therefor

An improved interconnect apparatus for high power circuits that is low in cost and amenable for integration with low power circuits in a single electronic package. The interconnect apparatus includes serially connected surface mount bus bars bridging two or more metal pads or traces formed on a standard circuit board of the type used to package low power circuitry. The surface mount bus bars operate not only to conduct the higher currents, but also to draw heat out of the metal pads or intervening portions of the metal traces. This keeps the temperature within the capabilities of low power circuit board technology, and allows very narrow high power interconnects for reduced package size. Manufacturing cost advantages are achieved because the surface mount bus bars are assembled by automated pick-and-place equipment of the same type used for other surface mount components used in the package. In certain circumstances, a series of surface mount bus bars may be placed atop a continuous metal trace, or overlapped to provide a minimum resistance connection.

High power surface mount interconnect apparatus for electrical power

An automotive circuit package combines electronic control functions and power function on a single circuit board substrate. Electronic components including signal level terminals are in one section of the substrate and an array of power terminals are in a second section of the substrate but sharing some common circuit paths carrying control signals. Supplemental conductors in the second section are selectively connected to power terminals to carry high current levels. Each terminal is a through access terminal for directly connecting conductors on the substrate, wiring harness connectors on one side of the substrate and fuses and relays on the other side of the substrate. In one embodiment the terminals have a male portion extending from one side of the substrate and a female portion on the other side. In another embodiment male and female portions are on the same side of the substrate and apertures in the substrate allow plugging into the female portions from the other side.

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Kokomo, IN, United States of America

David Jay Vess