Texas Instruments Corporation

David Jauregui

Juan Alejandro Herbsommer

Osvaldo Jorge Lopez

Jonathan Almeria Noquil

Rengang Chen

Scott Edward Ragona

Lucian Hriscu

Mark E Granahan

A switching converter having a high-side switching transistor and a low-side switching transistor and an inductor, having a circuit for generating a simulated waveform representing a sawtooth inductor current waveform. A circuit for monitoring and voltage at a switch node between the high-side and low-side transistors to determine a time during which the inductor current is increasing and a time during which the inductor current is decreasing wherein voltage across the low-side transistor when it is conducting represents a first portion of the simulated sawtooth inductor current waveform. A circuit for utilizing the time when the inductor current is increasing, the time when the inductor current is decreasing and the voltage across the low-side transistor when it is conducting to generate a portion of the simulated inductor current waveform when the high-side transistor is conducting. A method and a power supply utilizing this circuit are also disclosed.

Systems and methods for real-time inductor current simulation for a switching converter

A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

Fabricating a power supply converter with load inductor structured as heat sink

Systems and methods for regulating a switching converter are disclosed. One embodiment of the present invention relates to a power supply system that includes a switching converter that provides an output voltage by alternately turning on and off a high-side transistor and a low-side transistor both coupled to an output inductor through a switching node. The switching converter includes a drive circuit that regulates the output voltage based on a feedback signal. The power supply system also includes a simulated output generator that generates and provides the drive circuit with a simulated inductor waveform as the feedback signal based on a low-side output waveform of the low-side transistor measured at the switching node during off-times of the switching converter.

Systems and methods for real time current sense for a switching converter

A power supply converter () comprising a first FET () connected to ground (), the first FET coupled to a second FET () tied to an input terminal (), both FETs conductively attached side-by-side to a first surface of a metal carrier () and operating as a converter generating heat; and a packaged load inductor () tied to the carrier and an output terminal (), the inductor package wrapped by a metal sleeve () in touch with the opposite surface of the metal carrier, the sleeve operable to spread and radiate the heat generated by the converter.

DC-DC converter vertically integrated with load inductor structured as heat sink

A packaged power supply module () comprising a chip () with a first power field effect transistor (FET) and a second chip () with a second FET conductively attached side-by-side onto a conductive carrier (), the transistors having bond pads of a first area () and the carrier having bond pads of a second area () smaller than the first area. Conductive bumps () attached to the transistor bond pads and conductive bumps () attached to the carrier bond pads have equal volume and are coplanar (), the bumps on the transistor pads having a first height and the bumps on the carrier pads having a second height greater than the first height.

Synchronous buck converter having coplanar array of contact bumps of equal volume

A power supply module () comprising a metal leadframe with a pad () and a first metal clip () including a plate (), an extension () and a ridge (); the plate and extension are spaced from the leadframe pad, and the ridge connected to an input supply. A synchronous Buck converter is in the space between the clip plate and the leadframe pad, the converter including a control FET die () soldered onto a sync FET die (), the clip plate soldered to the control die having an input inductance (), and the sync die soldered to the leadframe pad having an output capacitance. A capacitor () integrated into the space between the clip extension and the leadframe pad, the clip extension soldered to the capacitor having a desired integrated inductance () operable to channel electrical energy from the switch node to ground.

Growing community of inventors

Bethlehem, PA, United States of America

David Jauregui