Ferro Corporation

Visteon Global Technolgoies, Inc.

David James Leandri

Aziz S Shaikh

Gordon J Roberts

Dana Lynn Hankey

Thomas J Vlach

S K Muralidhar

Ashish Lahoti

Susan Lynn Marr

A robust thick film conductor construction making an electric circuit connection of an electric component (20) to a Ag:Pd conductor (12) on a substrate. A substantially pure Ag conductor (10) is printed, dried, and fired on the substrate, then the Ag:Pd conductor is printed, dried, and fired such that a portion of the latter overlaps a portion of the Ag conductor. A first solder layer (16) is printed over the Ag conductor, including the overlap region (14), and reflowed. A second solder layer (18) is printed over the first printed solder layer at a region where the component (20) is to be placed and is reflowed after placement of the component to thereby join with the component.

Robust thick film conductors

A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-900.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2, and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 7.9, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

Low dielectric, low temperature fired glass ceramics

A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-950.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2 l , and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 5.2, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

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Skippack, PA, United States of America

David James Leandri