International Business Machines Corporation

Tellabs Operations, Inc.

David J Womac

Sushumna Iruvanti

Raed A Sherif

David L Edwards

Giulio DiGiacomo

Stephen S Drofitz, Jr

Hilton T Toy

Subhash Laxman Shinde

Kimon Papakos

Lester W Herron

David B Goland

Scott A Blakemore

Larry D Gross

Mark E Boduch

Giulio Di Giacomo

An apparatus, system, and method are provided for venting an enclosure, such as a chassis housing electronic equipment. The method includes receiving, at least one air directing surface, airflow moving in a first direction, the at least one air directing surface being disposed externally from the chassis at a predetermined placement relative to the at least one ventilation surface in a path of the airflow. The at least one air directing surface has a configuration to alter the direction of the airflow between the air directing surface and the at least one ventilation surface. The method also includes redirecting the airflow between the at least one air directing surface and the at least one ventilation surface to at least a second direction using the air directing surface. The predetermined placement and configuration of the at least one air directing surface determine the second direction in which the airflow is discharged, and the second direction is either towards or away from the at least one ventilation surface. Also in the receiving, the airflow is received at least one air directing surface of a bracket configured to attach the chassis to a mounting structure.

Apparatus, system, and method for venting a chassis

A chassis having a housing in which at least one card module can be arrange is provided. The chassis is arranged in a first rack horizontally or a second rack vertically wherein the second rack opening width is an integer multiple of the predetermined chassis width. A fan slot and ventilation openings are provided in the chassis to allow for airflow across the card modules. Mounting mechanisms facilitate coupling of the chassis to the first and second rack and include ventilation openings through which air passes.

Apparatus and method for configuring a dual rack-mountable chassis

A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

Multi-chip module and heat-sink cap combination

Structural support for direct lid attach

In a direct lid attach structure incorporating thermally conductive material between a lid and an electronic circuit chip, there are provided a number of apertures in the lid. These apertures are provided directly opposite disks or pads disposed on the substrate to which the chip is attached. A hardenable adhesive such as an epoxy is disposed through the apertures and hardened in place so as to provide a bond between the lid and the underlying pad which has been previously affixed to the substrate to which the chip is attached with a compliant adhesive. There is thus provided an electronic chip assembly which allows bonded chip-to-lid thermal interfaces to be used with LGA interconnection techniques. The support structure mitigates the mechanical loads associated with LGA socketing which could otherwise damage the substrate and affect the integrity of the bonded thermal interface.

Chip assembly with load-bearing lid in thermal contact with the chip

A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.

Method for bonding heatsink to multiple-height chip

An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.

Direct chip-cooling through liquid vaporization heat exchange

Multi-chip heat-sink cap assembly

Growing community of inventors

St. Charles, IL, United States of America

David J Womac