International Business Machines Corporation

David J Welsh

John Ulrich Knickerbocker

Mukta G Farooq

William E Bernier

Marie S Cole

Tasha E Lopez

John Anthony Fitzsimmons

Roger Allan Quon

Lewis Sigmund Goldmann

Tien-Jen Cheng

David E Eichstadt

Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.

Compressible films surrounding solder connectors

Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Low stress conductive polymer bump

Growing community of inventors

Salt Point, NY, United States of America

David J Welsh