Space Electronics, Inc.

Maxwell Technologies, Inc.

Maxwell Electronic Components Group, Inc.

Space Micro, Inc.

David J Strobel

David R Czajkowski

Michael Featherby

Edward Li

Phillip J Layton

Carl S Edwards

A composition for radiation shielding or range of compositions which compositions may be used for a variety of radiation shielding applications. With proper adhesive selection and processing, the construction forms an integral bond with the craft as compatible adhesives form strong bonds. This eliminates the potential for delaminating associated with the use of metallic layered shielding. While prior art protects electronics with a direct coating to electronic packages, this approach allows larger equipment systems, such as optics, or spectrometers, to be shielded.

Optimized nuclear radiation shielding within composite structures for combined man made and natural radiation environments

A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.

Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages

The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Methods and compositions for ionizing radiation shielding

Method for making a shielding composition

A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.

Radiation shielding of plastic integrated circuits

The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.

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Poway, CA, United States of America

David J Strobel