Cardiac Pacemakers, Inc.

David J Smith

Randy W Westlund

David R Wulfman

Daniel J Cooke

Christopher R Perrey

Anthony A Primavera

Tolga Tas

Vijesh Unnikrishnan

Rahul K Rajgarhia

Imad Libbus

Anthony V Caparso

Mark J Bly

Described is a medical device lead including a lead body having a conductor lumen including an inner surface. The lead also includes a conductor assembly extending through the conductor lumen; the conductor assembly comprising a conductor member and an outer insulative layer; and an electrode coupled to the conductor cable. The outer insulative layer includes a textured external surface that reduces the coefficient of friction between the outer insulative layer and the inner surface of the conductor lumen through which the conductor assembly extends. Methods of forming the conductor assembly are also described.

Lead with textured insulative layer

Systems and methods for steering one or more stimulation fields to a selected nerve target, thereby optimizing one or a combination of low stimulation thresholds, desired therapy outcomes, or a minimization of adverse stimulation side-effects. An array of electrodes disposed, at least in part, on two or more neural stimulation leads are used for steering the stimulation fields to the selected nerve target and are positioned adjacent the selected target. The stimulation may be titrated based on, among other things, a detected physiologic response to the applied stimulation.

Selective nerve stimulation with optionally closed-loop capabilities

An apparatus for performing a minimally-invasive surgical procedure in the vagus nerve region includes a cannula, an endoscopic dissection tool and a cradle assembly slideably disposed in a cannula lumen. The cradle assembly includes a C-ring, an electrode cuff disposed over an exterior surface of the C-ring, and a deployment device. The electrode cuff is adapted to wrap around the target nerve region or nerve branch to be stimulated when deployed from the C-ring using the deployment device. A method of performing a minimally invasive surgical procedure is also described.

Method and apparatus for endoscopic access to the vagus nerve

Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.

Flip chip die assembly using thin flexible substrates

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Shoreview, MN, United States of America

David J Smith