Ast Research, Inc.

Other

David J Silva

Edward D Suski

Glenn G Miner

Mitchell G Dorfmeyer

Jerry Merritt

Doug VanTassell

Kevin Harcourt

A tracking apparatus for use in tracking an arrow, crossbow bolt, or other suitable projectile, includes an electronics unit configured to be connected to a shaft of the projectile. The electronics unit includes a radio frequency ('RF') module. The RF module is electrically associated with a head of the projectile to cause the head to function as a first RF radiating element. The RF module is electrically associated with the shaft to cause the shaft to function as a second RF radiating element. One of the first RF radiating element and the second RF radiating element can be a poise, and the other of the first RF radiating element and the second RF radiating element can be a counterpoise.

Radio frequency tracking system for projectiles

A generally V-shaped drape formed of polymer or related materials and which functions as a sling to hold the scrotum upwardly, and out of place, during medical analysis and treatment. The drape includes a V-shaped member, formed of a highly flexible polymer, such as polyethylene, and includes a pressure sensitive adhesive area at its lower end, for application to the base of the scrotum, and further includes pressure sensitive adhesive at the upper legs of the V-shaped drape, for application to the abdomen wall, to provide a sling that flurnishes continuing clearance for access to and application of the various medical instrumentation used especially during treatment of the prostate, or other proximal anatomy located at this region of the patient.

Scrotal drape and support

A printed circuit board having a footprint that is capable of receiving one of two electronic components having differing pin configurations. The footprint includes a first and a second common pin receptor arranged about a first axis. The first and second common pin receptors are configured to receive a first and a second pin on either of the electronic components. The footprint also includes a third pin receptor that is positioned along the first axis so as to be interposed between the first and the second common pin receptors and is configured to receive a third pin receptor of the first electronic component. The footprint also includes a fourth pin receptor that is positioned along a second axis, that is orthogonal to and intersects the first axis at the location of the third pin receptor. The fourth pin receptor is configured to receive a third pin of the second electronic component. In one embodiment, the electronic components are surface mount EMI filters and the third and fourth pin receptors are electrically connected. Hence, electronic components having three pins that have two different configurations can be accommodated in the same footprint.

Printed circuit board having a dual pattern footprint for receiving one

A printed circuit board has a first plurality of pin receptors configured to receive a first type of SRAM memory device, a second plurality of pin receptors configured to receive a second type of SRAM memory device and a third plurality of pin receptors configured to receive a third type of SRAM memory device. The first plurality of pin receptors are formed in two parallel lines that extend in a first direction and define a portion of the boundary of a first area of the printed circuit board. The second and third pluralities of pin receptors are formed in the first area of the printed circuit board, with said second and third pluralities of pin receptors each comprising two parallel lines of pin receptors extending in a second direction, substantially orthogonal to the first direction. Conductive traces are formed between corresponding pin receptors in the first, second and third pluralities of pin receptors to thereby allow one of three different types of SRAM memory devices to be positioned on the footprint wherein the footprint occupies only the first area of the printed circuit board.

Printed circuit board having a triple pattern footprint for receiving

A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.

Dual pattern microprocessor package footprint

Solder pad for printed circuit boards

An improved omni-directional non-occluding solder pad design for printed circuit boards comprising a plurality of spokes radiating outward from a through-hole on the printed circuit board, with a ring concentric to the through-hole that intersects each of the plurality of spokes at approximately a perpendicular angle. The ringed-spoke configuration eliminates the need to ensure proper orientation of the solder pad on the printed circuit board prior to a wave soldering process since the symmetrical ringed-spoke design is omni-directional. The concentric ring structure provides an additional contact area of solder between the printed circuit board and a computer chassis. This additional contact area of solder ensures that there is a sufficient electrical connection between the printed circuit board and the computer chassis such that when the printed circuit board is mounted to the computer chassis, a proper grounding connection is provided.

Growing community of inventors

Trabuco Canyon, CA, United States of America

David J Silva