Plessey Overseas Limited

David J Pedder

Christopher J Wort

Kim L Pickering

Richard A Bache

Paul Watson

Vernier structure for flip chip bonded devices

A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.

Metal surface cleaning processes

A thermal detector of the type comprising an array of discrete detector elements each of which is supported by a common supportive layer, each of which is provided in thermal contact with a corresponding collector of radiation absorbent material, the area of each collector being larger than the area of the corresponding detector element, characterized in that contact between each collector and the supportive layer is restricted to an area lying substantially within and displaced from the edge periphery of said collector.

Growing community of inventors

Oxon, United Kingdom

David J Pedder