USA As Represented by Secretary of the Navy

Wright State University

Ohio State Innovation Foundation

David J Meyer

Brian P Downey

Paul Berger

Elliott R Brown

Weidong Zhang

David F Storm

Tyler Growden

Matthew T Hardy

Michael Shur

David A Deen

Daniel Somerset Green

Neeraj Nepal

Douglas S Katzer

Steven C Binari

D Scott Katzer

Neil P Green

Eric N Jin

Vikrant J Gokhale

Acoustic wave devices based on epitaxially grown heterostructures comprising appropriate combinations of epitaxially grown metallic transition metal nitride (TMN) layers, epitaxially grown Group III-nitride (III-N) piezoelectric semiconductor thin film layers, and epitaxially grown perovskite oxide (PO) layers. The devices can include bulk acoustic wave (BAW) devices, surface acoustic wave (SAW) devices, high overtone bulk acoustic resonator (HBAR) devices, and composite devices comprising HBAR devices integrated with high-electron-mobility transistors (HEMTs).

Multifunctional integrated acoustic devices and systems using epitaxial materials

Semiconductor devices having conductive floating gates superimposed on and/or embedded within a conducting channel for managing electromagnetic radiation in the device. The conductive floating gates can comprise a one- or two-dimensional array of asymmetric structures superimposed on and/or embedded within the conducting channel. The conductive floating gates can comprise NbN, TaN, TaN, NbN, WN, or MoNor any transition metal nitride compound. The device can include a plurality of conductive floating gates on a rear surface of a barrier layer, wherein each of the conductive floating gates might be separately biased for individual tuning. Antennas for capturing or emitting THz or sub-THz radiation could be attached to the device contacts. Terahertz or infrared radiation could be manipulated by driving a current through the conducting channel into a plasmonic boom regime. Additional manipulation of the electromagnetic radiation could be achieved by having antennas with an appropriate phase angle shift.

Device and method for managing electromagnetic radiation

Gallium nitride based devices and, more particularly to the generation of holes in gallium nitride based devices lacking p-type doping, and their use in light emitting diodes and lasers, both edge emitting and vertical emitting. By tailoring the intrinsic design, a wide range of wavelengths can be emitted from near-infrared to mid ultraviolet, depending upon the design of the adjacent cross-gap recombination zone. The innovation also provides for novel circuits and unique applications, particularly for water sterilization.

Gallium nitride cross-gap light emitters based on unipolar-doped tunneling structures

A method for integrating epitaxial, metallic transition metal nitride (TMN) layers within a compound semiconductor device structure. The TMN layers have a similar crystal structure to relevant semiconductors of interest such as silicon carbide (SiC) and the Group III-Nitrides (III-Ns) such as gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), and their various alloys. Additionally, the TMN layers have excellent thermal stability and can be deposited in situ with other semiconductor materials, allowing the TMN layers to be buried within the semiconductor device structure to create semiconductor/metal/semiconductor heterostructures and superlattices.

Epitaxial metallic transition metal nitride layers for compound semiconductor devices

A semiconductor device structure including a scandium (Sc)- or yttrium (Y)-containing material layer situated between a substrate and one or more overlying layers. The Sc- or Y-containing material layer serves as an etch-stop during fabrication of one or more devices from overlying layers situated above the Sc- or Y-containing material layer. The Sc- or Y-containing material layer can be grown within an epitaxial group III-nitride device structure for applications such as electronics, optoelectronics, and acoustoelectronics, and can improve the etch-depth accuracy, reproducibility and uniformity.

Scandium-containing III-N etch-stop layers for selective etching of III-nitrides and related materials

Methods for integrating transition metal oxide (TMO) layers into a compound semiconductor device structure via selective oxidation of transition metal nitride (TMN) layers within the structure.

Selective oxidation of transition metal nitride layers within compound semiconductor device structures

A method to remove epitaxial semiconductor layers from a substrate by growing an epitaxial sacrificial layer on the substrate where the sacrificial layer is a transition metal nitride (TMN) or a TMN ternary compound, growing one or more epitaxial device layers on the sacrificial layer, and separating the device layers from the substrate by etching the sacrificial layer to completely remove the sacrificial layer without damaging or consuming the substrate or any device layer. Also disclosed are the related semiconductor materials made by this method.

Lift-off of epitaxial layers from silicon carbide or compound semiconductor substrates

A process for fabricating a suspended microelectromechanical system (MEMS) structure comprising epitaxial semiconductor functional layers that are partially or completely suspended over a substrate. A sacrificial release layer and a functional device layer are formed on a substrate. The functional device layer is etched to form windows in the functional device layer defining an outline of a suspended MEMS device to be formed from the functional device layer. The sacrificial release layer is then etched with a selective release etchant to remove the sacrificial release layer underneath the functional layer in the area defined by the windows to form the suspended MEMS structure.

Method for fabricating suspended MEMS structures

A method for patterned deposition of an arbitrary thin film on an arbitrary substrate. A GaAs substrate having a bi-layer structure deposited thereon, the bi-layer structure consisting of a bottom layer of Ge and a top layer of SiN. A photoresist deposited on the top SiN surface of the sample is patterned to form one or more desired patterned features on the sample. The Ge&#x2014;SiN bi-layer structure on the patterned sample is aniostropically etched so that an undercut is formed in the Ge layer, the SiN forming an overhang over a portion of the GaAs substrate. The remaining photoresist is removed from the sample and the film is deposited on the sample to form a feature on the substrate. The remaining Ge layer is etched away and the SiN layer and film deposited on the SiN layer are lifted from the sample, leaving only the patterned features on the substrate.

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Fairfax Station, VA, United States of America

David J Meyer