Raytheon Company

David J Katz

Bruce William Chignola

Dennis Robert Kling

Stephen R Reid

Leonard Schaper

Jorge M Marcial

In one aspect, an integrated circuit (IC) system includes a receiver IC configured to receive a first clock signal and includes a feedback circuit configured to provide a feedback signal to a driver IC. The IC system also includes the driver IC configured to receive a second clock signal and includes a waveform generator configured to provide synthesized waveforms from DC to K-band, a serializer/deserializer (SERDES) to receive data from the waveform generator and to provide the signal to the receiver IC and a phase selection circuit to provide a phase selection signal to the first integrated circuit based on the feedback signal. The phase selection signal calibrates the signal from the SERDES and provides phase correction to the SERDES.

Waveform generator in a multi-chip system

In one aspect, an integrated circuit (IC) system includes a receiver IC configured to receive a first clock signal and includes a feedback circuit to provide a feedback signal to a driver IC. The system also includes the driver IC configured to receive a second clock signal and includes a phase selection circuit configured to provide a phase selection signal to the receiver IC based on the feedback signal. The phase selection signal controls the data received by the receiver IC by adjusting the first clock signal.

Chip interface

An improved microelectronic assembly () and packaging method includes a device package for housing a semiconductor die or chip, (), an array of passive electronic components (-) operating in cooperation with the flip chip semiconductor die () and housed inside the device package to decouple noise from input signals, and a heat spreader () disposed between a top surface of the semiconductor die () and a package cover (). The semiconductor die () is configured as a flip chip die and the device package includes a package substrate () configured as a ball grid array. The improved microelectronic device () reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate () and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Growing community of inventors

Andover, MA, United States of America

David J Katz