Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Fiber IP (singapore) Pte. Ltd

David J K Meadowcroft

Seng-Kum Chan

Paul Yu

Hui Xu

Laurence Ray McColloch

Ye Chen

Andrew Engel

Fang Wang

Michael John Brosnan

Ronald T Kaneshiro

Klaus D Giessler

Ron Kaneshiro

Li Ding

Omid Momtahan

Frank David Yashar

Robert G Ritter

Pengyue Wen

Chaitanya Arekar

An-Nien Cheng

A heat dissipation system for an optical communications module is provided that includes a cold block on which the optoelectronic components and a lens assembly of an OSA of the module are mounted. The cold block has precisely-controlled mounting surface heights that precisely passively align the lens assembly in directions normal to mounting surfaces of the cold block. The cold block is made of a material of very high thermal conductivity, typically copper, so that heat generated by the optoelectronic components is dissipated into the cold block to maintain the optoelectronic components well below maximum allowable temperatures. In addition, an optical interface device of the OSA has a low-profile and an optical configuration that allows it to be used with a high optical fiber count.

Methods, devices and systems that dissipate heat and facilitate optical alignment in optical communications modules

A parallel optical communications module includes a top lens and a bottom lens that are spaced from one another to inhibit mechanical forces acting upon the top lens from being transferred to the bottom lens, which is optically aligned with an opto-electronic light source or light detector. The top lens has a reflector portion configured to redirect the optical signals between the bottom lens and one or more optical fibers.

Parallel optical transceiver with top and bottom lenses

A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.

Mounting block and a mounting assembly that incorporates the mounting block

An optical transceiver module is provided with a delatching mechanism that allows module mounting density to be increased while also providing an ergonomic solution that allows the modules to be easily delatched and extracted from their cages. The delatching mechanism is configured to perform early disengagement of the module housing from the cage by delatching the module housing from the cage after the bail has been rotated to an angle that is less than 90&#xb0;. Because delatching occurs when the bail has been rotated to a delatching angle that is less than 90&#xb0;, the modules can be more densely stored with less space between modules that are mounted one above the other than with existing solutions.

Optical transceiver module having an early-disengage delatching mechanism

An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Lens device attachment to printed circuit board

Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

Methods and systems for dissipating heat in optical communications modules

A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.

A connector cover includes a body having a lower recessed portion configured to receive a portion of a reflecting connector of a type that retains the ends of optical fibers therein and has a reflector that redirects or turns the optical signals. The body has an upper housing portion that covers the reflector when the reflecting connector is received in the lower recessed portion of the body. The body also has a pair of arms extending from a forward end of the body. Each arm has a distal end with an arm distal end engagement. The arms are configured to engage a portion of an optical transceiver module.

Optical module connector system and method

In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Air-cooled optical transceiver module system

A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.

Side-edge mountable parallel optical communications module, an optical communications system that incorporates the module, and a method

A Z-pluggable optical communications module (OCM) is provided that contains multiple parallel OCMs (POCMs) and that is configured to be removably plugged into an opening formed in a front panel of an optical communications system. When the Z-pluggable OCM is plugged in a forward Z-direction into the opening formed in the front panel, an actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the downward Y-direction to cause the Z-pluggable OCM to be mounted on an upper surface of a motherboard PCB. In order to unplug the Z-pluggable OCM, the actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the upward Y-direction to cause it to be dismounted from the motherboard PCB.

Z-pluggable optical communications module, an optical communications system, and a method

A flexible dust cover is provided for use with a parallel optical communications module for preventing airborne matter, such as dirt, dust, and gases from entering the module. The flexible dust cover fits snugly to the module to protect components of the module and the optical pathways of the module from airborne matter. The flexible dust cover has an elasticity that allows it to be temporarily deformed from its original shape to a stretched state by application of a stretching force to enable the module to be inserted into a central opening formed in the cover. The force is then removed, causing the cover to attempt to return to its original, non-stretched shape. When this happens, interior surfaces of the cover form a snug fit about exterior surfaces of the module. This snug fit fills in air gaps in the module that would otherwise be exposed to the environment.

Flexible dust cover for use with a parallel optical communications module to prevent airborne matter from entering the module, and a method

An opto-electronic system includes a substrate, an opto-electronic chip mounted on the substrate, a frame, and a lens device retained in the frame. A frame mounting portion of the frame is in contact with an upper surface of the opto-electronic chip. A lens mounting portion of the frame is spaced above the frame mounting portion. A lower surface of the lens device is in contact with the lens mounting portion. The spacing of the lens mounting portion and frame mounting portion determines the spacing between the upper surface of the opto-electronic chip and the lower surface of the lens device.

Lens standoff and protection for optical communication systems

A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.

Growing community of inventors

San Jose, CA, United States of America

David J K Meadowcroft