Cray Research, Inc.

Cray Computer Corporation

David J Johnson

Nicholas J Krajewski

Arthur O Kunstmann

Kent T McDaniel

William T Moore, Jr

Bricky A Stephenson

Carl D Breske

David R Kiefer

Michael R Edwards

Anthony A Vacca

Johannes N Gaston

Eugene N Reshanov

Seymour R Cray

David W LeMay

The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.

High density interconnect apparatus

An apparatus and method of making a beam of directed energy used to bond leads to bonding areas is disclosed. The masking tool preferably includes a groove adapted to allow the beam to strike the lead while masking the surrounding substrate to prevent damage to it. The tool preferably reflects the energy striking it away from the substrate. The method can include the use of an external heat source to provide heat to the bonding process or, in the alternative, provide heat sinking to protect the electrical components from heat damage. Alternate embodiments of the tool can include a plurality of grooves or slots to allow scanning of the beam in the bonding process.

Method and apparatus for laser masking of lead bonding

Computer cabinet

Z-axis connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the connector to frictionally engage the through-plated holes on at least two boards.

Z-axis connectors for stacked printed circuit board assemblies

Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards.

Z-axis pin connectors for stacked printed circuit board assemblies

Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards. Formation of pin connectors from a resilient thermoplastic material coated with a conductive layer is also disclosed.

Z-Axis pin connectors for stacked printed circuit board assemblies

A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked circuit board assemblies where kinked memory metal wires are stretched so the wires are substantially straight; inserted into axially aligned through-plated holes of circuit boards; and released so that the memory metal wires reform their original kinked shaped within the through-plated holes, forming an electrical connection between the circuit boards. Memory metal alloys are used in the construction of the kinked memory metal wires to take advantage of the pseudoelastic behavior of the alloys in the austenitic phase below the forming temperature range.

Growing community of inventors

Chippewa Falls, WI, United States of America

David J Johnson