Amp LLC

David J Goetzinger

Robert M Renn

Frederick R Deak

Albert Casciotti

Ronald A Dery

A high density connector (10) for electrically interconnecting conductive paths (14, 84) on close centers between circuit boards such as those of a backpanel (82) and daughter cards (12), includes a clamping mechanism (18, 20) bolted first to a daughter card and then to a backpanel to compress springs (46, 48, 50) held by the mechanism driving flat flexible circuits (52) having contacts (68, 70) on close centers to engage board circuit paths, where the mechanism (18, 20) is rigid and includes spring driven clamps (42) to straighten the daughter card and strain relief the interconnection area. The flexible circuit contacts (68, 70) are offset relative to the springs (48, 50) bearing area to provide a contact wipe of the contact path interconnection.

High density backplane connector

A high density electrical connector (10) includes a flexible circuit (28) carrying circuit traces (32, 34) mounted on rod elements (38) driven by a cam means (60) to provide wipe and backwipe interconnections between board circuit traces (14, 18). A shape memory alloy (84) is employed to effect cam drive in one embodiment and an operating arm is utilized to effect cam drive in another embodiment.

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Winston-Salem, NC, United States of America

David J Goetzinger