Raytheon Company

David J Drapeau

Christopher A Moye

Reza Tayrani

Tamrat Akale

Ron K Nakahira

Lawrence Dalconzo

Eduardo D Barrientos, Jr

Michael T Crnkovich

Larry Dalconzo

Eduardo D Barrientos

Jr Barrientos Eduardo D

A compact multilayer signal processing system. In the illustrative embodiment, the system is adapted for use with microwave signals. The system includes a first mechanism for receiving an input signal and selectively routing the input signal onto a first signal path. A second mechanism routes the input signal along the first signal path vertically through one or more layers to a first circuit component. The first circuit component outputs an adjusted signal in response to receipt of the input signal. A third mechanism directs the adjusted signal to the output of the system. In a specific embodiment, the one or more layers include one or more groundplane layers. In this embodiment, the first mechanism includes an input switching network in communication with a controller. The switching network is positioned on a switching layer and communicates with one or more controllers to facilitate selectively switching the input signal onto one of plural input signal paths. The second mechanism further includes a first input waveguide that extends from the input switching network vertically through at least one groundplane layer and to an input end of the first circuit component. The third mechanism includes a first output waveguide extending from an output end of the first circuit component, vertically through at least one groundplane layer to an output switching network disposed on the switching layer. In the specific embodiment, the circuit layer includes plural circuit components that are coupled to respective input waveguides and output waveguides that extend vertically through the first groundplane layer to the input switching network and the output switching network, respectively.

Compact multilayer circuit

RF filter circuits are described which include a bottom dielectric substrate fabricated of a high dielectric material having a relative dielectric constant in a range of 30 to 100. A conductor pattern defining a circuit topology is fabricated on a surface of the substrate.

Miniature RF stripline linear phase filters

A technique for providing an elastic RF interconnection between first and second planar conductors, which provides stress relief against mechanical and environment stresses. A length of a compressible wire bundle having first and second end portions is used as the elastic conductor. The first end portion is attached to an end of the first conductor. The second end portion is attached to an end of the second conductor. In a typical application, the first and second conductors are disposed on separate substrates, in turn mounted to a package surface.

Planar interconnects using compressible wire bundle contacts

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Los Angeles, CA, United States of America

David J Drapeau