The Charles Stark Draper Laboratory, Inc.

Massachusetts Institute of Technology

The General Hospital Corporation

Other

David J Carter

Eugene H Cook

Henry Ignatius Smith

Rajesh Menon

Dario Gil

William Whitcomb McFarland

Marc Steven Weinberg

George Barbastathis

Amy Elizabeth Duwel

Graham Arrick

Jeffrey T Borenstein

Peter Miraglia

Joseph P Vacanti

Mathew Varghese

Isaac Mayer Ehrenberg

Daniel F King

Alexander Sawyer

Juliette E Mahaffey

Gayatri E Perlin

Robert Samuel Langer

Jonathan Jay Bernstein

Jeffrey Michael Karp

Mark Joseph Mescher

Christopher J Bettinger

Tirunelveli Subramaniam Sriram

James Gregory Goodberlet

Douglas W White

Andreas Zumbuehl

Arnis Mangolds

John Joseph LeBlanc

Peter A Kerrebrock

Jeffrey Todd Hastings

Jesse M Carr

Edwin P Chan

Alla A Gimbel

Parshant Kumar

Clayton Morris

Robert Langer

Bernard M Antkowiak

Gary L Wasserman

Luke Hohreiter

Nicolas A Macias

Glenn Ogrodnik

Maxim Bushmelov

Mahdavi Alborz

Lino Ferreira

Joung-Mo Kang

Zoltan S Spakovszky

A reservoir provided in a hard-point fixture is pre-loaded with a curable adhesive, where the reservoir is protected from the curing radiation. The fixture is placed on a target surface and the adhesive is extruded from the reservoir into a space between the fixture and the target surface. An irradiating device to cure the adhesive is provided in the fixture and activated to couple the fixture to the surface. Once the curing process is complete, the fixture is released from the placement system leaving the fixture affixed to the target surface.

Hard-point fixture for attaching to a target surface

A hard-point fixture placement system places a fixture that is pre-loaded with a curable adhesive by mechanically extruding the adhesive between the fixture and a target surface to which the fixture is to be attached. The placement system includes an irradiating device to cure the adhesive. The hard-point fixture stores the adhesive in a reservoir that is protected from the curing radiation. Once the curing process is complete, the fixture is released from the placement system leaving the fixture affixed to the target surface.

Hard-point fixture and system for attaching the fixture to a target surface

A mold for casting a micro-scale structure includes an upper surface including a first cavity having a first depth. A negative pattern for an array of micro-scale structures is defined in a surface of the first cavity. The mold includes at least one second cavity having a second depth defined in the cavity outside of the negative pattern for the array of micro-scale structures. The at least one second cavity defines a negative pattern for a standoff of the micro-scale structure. A fabric retaining frame is disposed in the first cavity.

Polymer microwedges and methods of manufacturing same

A surface affixable device incorporating mechanically actuated dry adhesive includes a body and a plurality of tiles affixed to the body. Each of the plurality of tiles includes an array of dry adhesive material elements disposed on front faces thereof. A first of the plurality of tiles is movably affixed to the body. An actuator is constructed and arranged to displace the first of the plurality of tiles in a first direction relative to a second of the plurality of tiles. A biasing element applies a bias to the first of the plurality of tiles in a second direction upon displacement of the first of the plurality of tiles in the first direction.

Surface affix-able device incorporating mechanically actuated dry adhesive

A hybrid adhesion system includes an adhesion head including at least one suction cup and a handle and a vacuum generator mechanically coupled to the adhesion head. The vacuum generator includes at least one pneumatic cylinder having an internal volume in fluid communication with the at least one suction cup and a piston having a piston rod mechanically coupled to a manual actuator.

Hybrid adhesion system and method

A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.

Method for realizing ultra-thin sensors and electronics with enhanced fragility

In one embodiment, a rotary device includes a multiwall nanotube that extends substantially perpendicularly from a substrate. A rotor may be coupled to an outer wall of the multiwall nanotube, be spaced apart from the substrate, and be free to rotate around an elongate axis of the multiwall nanotube.

Rotary nanotube bearing structure and methods for manufacturing and using the same

An adhesive article includes a biocompatible and at least partially biodegradable substrate having a surface; and a plurality of protrusions extending from the surface. The protrusions include a biocompatible and at least partially biodegradable material, and have an average height of less than approximately 1,000 micrometers.

Adhesive articles

The present invention relates to tissue engineered compositions and methods comprising nanotopographic surface topography ('nanotopography') for use in modulating the organization and/or function of multiple cell types.

Nanotopographic compositions and methods for cellular organization in tissue engineered structures

Adhesive systems may be fabricated to include first and second solid adhesion structures. The first adhesion structure may require an applied normal preload force to achieve adhesion to a surface. The second solid adhesion structure may be separate from but joined to the first adhesion structure such that both adhesion structures are jointly adherable to the surface upon application of the normal preload force.

Multi-component adhesive system

A method is disclosed for forming an array of focusing elements for use in a lithography system. The method involves varying an exposure characteristic over an area to create a focusing element that varies in thickness in certain embodiments. In further embodiments, the method includes the steps of providing a first pattern via lithography in a substrate, depositing a conductive absorber material on the substrate, applying an electrical potential to at least a first portion of the conductive absorber material, leaving a second portion of the conductive material without the electrical potential, and etching the second portion of the conductive material to provide a first pattern on the substrate that is aligned with the first portion of the conductive absorber material.

System and method for fabrication and replication of diffractive optical elements for maskless lithography

Growing community of inventors

Concord, MA, United States of America

David J Carter