Other

International Business Machines Corporation

International Flex Technologies, Inc.

David J Bajkowski

Allan Robert Knoll

Daniel P Labzentis

Francesco F Marconi

Mark Alan Brown

Daniel Stephen Potsko

Richard Emerson Cole

Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semiconductor chips. This method eliminates the requirement to buss all circuits to a common plating contact by using a background seed metal for plating continuity. This method also provides a means to alleviate the requirement for precise registration or alignment when multiple photoresist layers are employed in order to selectively plate only a portion of the metallic elements present on the flexible circuit board. The defect of resist lifting followed by nickel/gold underplating is eliminated by conditioning the intermediate photoresist to survive the nickel/gold plating bath.

Method of producing flex circuit with selectively plated gold

A fluid treating device with at least one chamber, a plurality of ultrasonic transducers for imparting ultrasonic waves through fluid when present in the at least one chamber; a screen located in the at least one chamber wherein the screen is coated with a dielectric material. The coated screen diffuses the ultrasonic waves and enhances uniform treatment. The fluid treating device is useful for treatments such as cleaning, degreasing, plating or etching articles such as ceramic substrates.

Fluid treatment device and method

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Hallstead, PA, United States of America

David J Bajkowski