Acm Research (shanghai) Inc.

Nomura Micro Science Co., Ltd.

David Hui Wang

Yue Ma

Voha Nuch

Yunwen Huang

Chuan He

Jian Wang

Fufa Chen

Liangzhi Xie

Takayuki Jizaimaru

Zhenxu Pang

Xi Wang

A functional water producing apparatus in an embodiment includes: a water pressure regulator configured to regulate the water pressure of the ultrapure water, the water pressure regulator having a pressure regulating valve configured to regulate a water pressure of the ultrapure water to an almost constant pressure and a feed water pump configured to pressurize the ultrapure water; a dissolving device configured to dissolve functional gas imparting a specific function in the ultrapure water regulated the water pressure by the water pressure regulator; and a control device configured to control the feed water pump to regulate the water pressure of the functional water to a predetermined constant pressure based on a water pressure or a flow rate of the functional water flowing out of the dissolving device.

Functional water producing apparatus and functional water producing method

A method of producing washing hydrogen water in an embodiment, includes: a step of storing ammonia water in a first tank; a step of transferring the ammonia water from the first tank to a second tank; a step of diluting the transferred ammonia water with ultrapure water in the second tank; a step of mixing the diluted ammonia water into hydrogen water; and a washing step of washing an inside of the first tank by ultrapure water to remove fine particles derived from ammonia generated in the first tank.

Washing hydrogen water producing method and producing apparatus

The present invention improves the wetting between process solution and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface. The pre-implementing adsorbed liquid is fully filled in the patterned structures formed on the wafer by multilayer absorption of the vaporized liquid molecules and the temperature of the wafer surface is above dew point of the vaporized liquid while condensing, which avoids generating bubbles inside the patterned structures.

Method to prewet wafer surface

An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

Methods and apparatus for cleaning semiconductor wafers

The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.

Plating apparatus for metallization on semiconductor workpiece

The present invention provides an apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpiece.

Growing community of inventors

Shanghai, China

David Hui Wang