Intel Corporation

Transat Technologies, Inc.

David Hui

Ling Liao

John Baker

Martin Greenwood

Antti Linden

Ravindranath Vithal Mahajan

Donald Tiendung Tran

Vladimir K Tamarkin

Srikant Nekkanty

Andrew Alduino

Yong Zhou

Suresh V Pothukuchi

Sushrutha Reddy Gujjula

David M Bond

Harinadh Potluri

Adrian Buckley

Zuoguo Wu

Haisheng Rong

Ganesh Balamurugan

Susheel G Jadhav

Craig Schulz

Syed S Islam

Prasanna J Satarasinghe

Meer Nazmus Sakib

Hao Li

Aliasghar Eftekhar

Kenneth Brown

Saeed Fathololoumi

Duanni Huang

Taehwan Kim

Chaoxuan Ma

Sushrutha Gujjula

Chihhao Chen

Mohammad Montazeri Najafabadi

Yong Zhoe

David Bond

In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.

Apparatus, method, and system for performing error correction based on laser power setting

Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

Integrated photonics and processor package with redistribution layer and EMIB connector

The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

Photonic wavelength division multiplexing (WDM) receiver with polarization diversity and/or low reflectance

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Dual-sided co-packaged optics for high bandwidth networking applications

An optical communications circuit has a communications light signal source and a heat pump coupled to cool the signal source. A controller monitors a current and a temperature of the signal source, and regulates the temperature. The controller updates a heat pump control limit parameter for the heat pump, based on the monitored current. Other embodiments are also described and claimed.

Optical communications circuit current management

The present disclosure provides a system and method for providing a flexible architecture for attaching computing devices to wireless networks.

Flexible architecture for wireless communication networks

The present disclosure provides a system and method for an SS7 gateway for wireless networks.

SS7 gateway for wireless communication networks

A system for transmitting wireless messages from a Wireless Access Internet Network architecture for providing users a plurality of wireless protocols to access a communications network. The architecture comprises a wireless client for providing an authentication message. The wireless client includes a radio link adaptation layer and a radio interface, and the radio link adaptation layer adapts to a plurality of wireless protocols. The architecture further includes a wireless server in communication with the wireless client. The wireless server includes a charging module, a Home Location Register (HLR) signaling module, a Domain Naming System (DNS)/Dynamic Host Configuration Protocol (DHCP) Remote Authentication Dial-in User Service (RADIUS) module, a radio link adaptation layer, and a radio access point in communication with the radio interface. Additionally, the architecture includes a data network in communication with the wireless server.

Adaptable radio link for wireless communication networks

Growing community of inventors

Fremont, CA, United States of America

David Hui